Prediction of fatigue life of semiconductor package under thermal cycling: Combined effect of package design and solder materials
Thermal fatigue tests of semiconductor packages were conducted varying solder materials such as SAC305 and SAC302 with Bi, Ni, and Pd (named hybrid solder ball, HSB) and number of chips inside the package at temperatures ranging from 0 °C to 120°. The fatigue life and fatigue crack types of the sold...
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| Format: | Article |
| Language: | English |
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Elsevier
2025-06-01
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| Series: | Materials & Design |
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| Online Access: | http://www.sciencedirect.com/science/article/pii/S0264127525004794 |
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| author | Heon-Su Kim You-Gwon Kim Dong-Min Jang Jin-Woo Jang Seung-Yeong Lee Hak-Sung Kim |
| author_facet | Heon-Su Kim You-Gwon Kim Dong-Min Jang Jin-Woo Jang Seung-Yeong Lee Hak-Sung Kim |
| author_sort | Heon-Su Kim |
| collection | DOAJ |
| description | Thermal fatigue tests of semiconductor packages were conducted varying solder materials such as SAC305 and SAC302 with Bi, Ni, and Pd (named hybrid solder ball, HSB) and number of chips inside the package at temperatures ranging from 0 °C to 120°. The fatigue life and fatigue crack types of the solder joint or Cu trace in PCB were monitored by electrical resistance measuring with daisy chain. It was found that the fatigue life and fatigue crack type (solder joint crack or Cu trace crack) were influenced and changed significantly by package geometry and solder joint materials. To predict the crack type and fatigue life of the package, finite element analysis (FEA) was conducted. To analyze the thermal behavior of solder, the creep tests of SAC305 and HSB (SAC302 with Bi, Ni, and Pd) were conducted with respect to temperature and strain rate and their Anand constants were derived. The solder fatigue life was determined using the strain energy-based Morrow’s model, while the Cu trace fatigue life was determined using the strain-based Miner’s model. The predicted fatigue life and crack type from FE analysis agreed well with the experimental results. |
| format | Article |
| id | doaj-art-9231b7fb2f634ecb840ed126f9f3f1cd |
| institution | OA Journals |
| issn | 0264-1275 |
| language | English |
| publishDate | 2025-06-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Materials & Design |
| spelling | doaj-art-9231b7fb2f634ecb840ed126f9f3f1cd2025-08-20T02:35:43ZengElsevierMaterials & Design0264-12752025-06-0125411405910.1016/j.matdes.2025.114059Prediction of fatigue life of semiconductor package under thermal cycling: Combined effect of package design and solder materialsHeon-Su Kim0You-Gwon Kim1Dong-Min Jang2Jin-Woo Jang3Seung-Yeong Lee4Hak-Sung Kim5Department of Mechanical Convergence Engineering, Hanyang University, 222, Wangsimni-ro, Seongdong-gu, Seoul, Republic of KoreaDepartment of Mechanical Convergence Engineering, Hanyang University, 222, Wangsimni-ro, Seongdong-gu, Seoul, Republic of KoreaSAMSUNG Electronics R&D division, Gyeonggi-do, 17113, South KoreaSAMSUNG Electronics R&D division, Gyeonggi-do, 17113, South KoreaSAMSUNG Electronics R&D division, Gyeonggi-do, 17113, South KoreaDepartment of Mechanical Convergence Engineering, Hanyang University, 222, Wangsimni-ro, Seongdong-gu, Seoul, Republic of Korea; Hanyang Research Center for Advanced Semiconductor Packaging, Hanyang University, Seoul 133-791 South Korea; Corresponding author.Thermal fatigue tests of semiconductor packages were conducted varying solder materials such as SAC305 and SAC302 with Bi, Ni, and Pd (named hybrid solder ball, HSB) and number of chips inside the package at temperatures ranging from 0 °C to 120°. The fatigue life and fatigue crack types of the solder joint or Cu trace in PCB were monitored by electrical resistance measuring with daisy chain. It was found that the fatigue life and fatigue crack type (solder joint crack or Cu trace crack) were influenced and changed significantly by package geometry and solder joint materials. To predict the crack type and fatigue life of the package, finite element analysis (FEA) was conducted. To analyze the thermal behavior of solder, the creep tests of SAC305 and HSB (SAC302 with Bi, Ni, and Pd) were conducted with respect to temperature and strain rate and their Anand constants were derived. The solder fatigue life was determined using the strain energy-based Morrow’s model, while the Cu trace fatigue life was determined using the strain-based Miner’s model. The predicted fatigue life and crack type from FE analysis agreed well with the experimental results.http://www.sciencedirect.com/science/article/pii/S0264127525004794SolderCopperReliabilityCrack typeFatigue lifeThermal cycling |
| spellingShingle | Heon-Su Kim You-Gwon Kim Dong-Min Jang Jin-Woo Jang Seung-Yeong Lee Hak-Sung Kim Prediction of fatigue life of semiconductor package under thermal cycling: Combined effect of package design and solder materials Materials & Design Solder Copper Reliability Crack type Fatigue life Thermal cycling |
| title | Prediction of fatigue life of semiconductor package under thermal cycling: Combined effect of package design and solder materials |
| title_full | Prediction of fatigue life of semiconductor package under thermal cycling: Combined effect of package design and solder materials |
| title_fullStr | Prediction of fatigue life of semiconductor package under thermal cycling: Combined effect of package design and solder materials |
| title_full_unstemmed | Prediction of fatigue life of semiconductor package under thermal cycling: Combined effect of package design and solder materials |
| title_short | Prediction of fatigue life of semiconductor package under thermal cycling: Combined effect of package design and solder materials |
| title_sort | prediction of fatigue life of semiconductor package under thermal cycling combined effect of package design and solder materials |
| topic | Solder Copper Reliability Crack type Fatigue life Thermal cycling |
| url | http://www.sciencedirect.com/science/article/pii/S0264127525004794 |
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