Kim, H., Kim, Y., Jang, D., Jang, J., Lee, S., & Kim, H. Prediction of fatigue life of semiconductor package under thermal cycling: Combined effect of package design and solder materials. Elsevier.
Chicago Style (17th ed.) CitationKim, Heon-Su, You-Gwon Kim, Dong-Min Jang, Jin-Woo Jang, Seung-Yeong Lee, and Hak-Sung Kim. Prediction of Fatigue Life of Semiconductor Package Under Thermal Cycling: Combined Effect of Package Design and Solder Materials. Elsevier.
MLA (9th ed.) CitationKim, Heon-Su, et al. Prediction of Fatigue Life of Semiconductor Package Under Thermal Cycling: Combined Effect of Package Design and Solder Materials. Elsevier.
Warning: These citations may not always be 100% accurate.