THE EFFECT OF SURFACTANTS ON SUPERCONFORMAL DEPOSITION OF ELECTROLESS COMPOSITES IN NANOSCALE PATTERNS
Electroless plating of metal composites has been proposed as a promising method for metallization of high aspect ratio trenches for micro- and nanoelectronics and microelectromechanical systems application. Deposition of Ag(W) electroless films was performed from ammoniate silver solution to fill de...
Saved in:
| Main Author: | |
|---|---|
| Format: | Article |
| Language: | Russian |
| Published: |
Educational institution «Belarusian State University of Informatics and Radioelectronics»
2019-06-01
|
| Series: | Doklady Belorusskogo gosudarstvennogo universiteta informatiki i radioèlektroniki |
| Subjects: | |
| Online Access: | https://doklady.bsuir.by/jour/article/view/692 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| _version_ | 1849398412070354944 |
|---|---|
| author | V. A. Bogush |
| author_facet | V. A. Bogush |
| author_sort | V. A. Bogush |
| collection | DOAJ |
| description | Electroless plating of metal composites has been proposed as a promising method for metallization of high aspect ratio trenches for micro- and nanoelectronics and microelectromechanical systems application. Deposition of Ag(W) electroless films was performed from ammoniate silver solution to fill deep damascene trenches. Polyethylene glycol (PEG) with molecular weight of 400, 1500 and 6000, RE-610 and Triton X-100 were studied as an additives in the plating bath for superconformal deposition. The deposition rate, resistivity, grain size and the trench filling behaviour were studied as a function of the additives concentration and deposition temperature using Scanning Electron Microscopy (SEM) cross section study. The PEG with molecular mass about 1500 was found to provide superconformal Ag(W) electroless growth in nanometre wide trenches. |
| format | Article |
| id | doaj-art-922d2f210e704a1db91af455d08d8d79 |
| institution | Kabale University |
| issn | 1729-7648 |
| language | Russian |
| publishDate | 2019-06-01 |
| publisher | Educational institution «Belarusian State University of Informatics and Radioelectronics» |
| record_format | Article |
| series | Doklady Belorusskogo gosudarstvennogo universiteta informatiki i radioèlektroniki |
| spelling | doaj-art-922d2f210e704a1db91af455d08d8d792025-08-20T03:38:38ZrusEducational institution «Belarusian State University of Informatics and Radioelectronics»Doklady Belorusskogo gosudarstvennogo universiteta informatiki i radioèlektroniki1729-76482019-06-010597101691THE EFFECT OF SURFACTANTS ON SUPERCONFORMAL DEPOSITION OF ELECTROLESS COMPOSITES IN NANOSCALE PATTERNSV. A. Bogush0Belarusian State University of Informatics and RadioelectronicsElectroless plating of metal composites has been proposed as a promising method for metallization of high aspect ratio trenches for micro- and nanoelectronics and microelectromechanical systems application. Deposition of Ag(W) electroless films was performed from ammoniate silver solution to fill deep damascene trenches. Polyethylene glycol (PEG) with molecular weight of 400, 1500 and 6000, RE-610 and Triton X-100 were studied as an additives in the plating bath for superconformal deposition. The deposition rate, resistivity, grain size and the trench filling behaviour were studied as a function of the additives concentration and deposition temperature using Scanning Electron Microscopy (SEM) cross section study. The PEG with molecular mass about 1500 was found to provide superconformal Ag(W) electroless growth in nanometre wide trenches.https://doklady.bsuir.by/jour/article/view/692electroless deposition surfactantmicroelectronics metallizationmetal composite thin film |
| spellingShingle | V. A. Bogush THE EFFECT OF SURFACTANTS ON SUPERCONFORMAL DEPOSITION OF ELECTROLESS COMPOSITES IN NANOSCALE PATTERNS Doklady Belorusskogo gosudarstvennogo universiteta informatiki i radioèlektroniki electroless deposition surfactant microelectronics metallization metal composite thin film |
| title | THE EFFECT OF SURFACTANTS ON SUPERCONFORMAL DEPOSITION OF ELECTROLESS COMPOSITES IN NANOSCALE PATTERNS |
| title_full | THE EFFECT OF SURFACTANTS ON SUPERCONFORMAL DEPOSITION OF ELECTROLESS COMPOSITES IN NANOSCALE PATTERNS |
| title_fullStr | THE EFFECT OF SURFACTANTS ON SUPERCONFORMAL DEPOSITION OF ELECTROLESS COMPOSITES IN NANOSCALE PATTERNS |
| title_full_unstemmed | THE EFFECT OF SURFACTANTS ON SUPERCONFORMAL DEPOSITION OF ELECTROLESS COMPOSITES IN NANOSCALE PATTERNS |
| title_short | THE EFFECT OF SURFACTANTS ON SUPERCONFORMAL DEPOSITION OF ELECTROLESS COMPOSITES IN NANOSCALE PATTERNS |
| title_sort | effect of surfactants on superconformal deposition of electroless composites in nanoscale patterns |
| topic | electroless deposition surfactant microelectronics metallization metal composite thin film |
| url | https://doklady.bsuir.by/jour/article/view/692 |
| work_keys_str_mv | AT vabogush theeffectofsurfactantsonsuperconformaldepositionofelectrolesscompositesinnanoscalepatterns AT vabogush effectofsurfactantsonsuperconformaldepositionofelectrolesscompositesinnanoscalepatterns |