Thermal Simulation and Experimental Research of EMU Logic Control Box
Aiming at the problem of over temperature of relay surface in logic control cabinet of EMU, a heat dissipation structure was proposed to improve the relay surface temperature. Through simulation, the changes of relay surface temperature and inner cavity temperature of logic control cabinet before an...
Saved in:
| Main Authors: | , , , , , |
|---|---|
| Format: | Article |
| Language: | zho |
| Published: |
Editorial Department of Electric Drive for Locomotives
2020-07-01
|
| Series: | 机车电传动 |
| Subjects: | |
| Online Access: | http://edl.csrzic.com/thesisDetails#10.13890/j.issn.1000-128x.2020.04.027 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| Summary: | Aiming at the problem of over temperature of relay surface in logic control cabinet of EMU, a heat dissipation structure was proposed to improve the relay surface temperature. Through simulation, the changes of relay surface temperature and inner cavity temperature of logic control cabinet before and after the improvement were analyzed when the logic control cabinet was in full power operation, and verified by temperature rise test. The simulation and test results showed that the heat dissipation structure could improve the relay surface temperature and the inner cavity temperature of the logic control box. |
|---|---|
| ISSN: | 1000-128X |