Miniaturized Ku-band transceiver based on 3D integration technology
With silicon-based 3D integrated module and multilayer hybrid pressing printed circuit board(PCB) technique, a miniaturized Ku-band transceiver was designed, and meanwhile its principle project and approach were expounded. The transceiver employed 3D integrated structure. Radio frequency(RF) and int...
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| Main Authors: | , , , |
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| Format: | Article |
| Language: | zho |
| Published: |
National Computer System Engineering Research Institute of China
2022-05-01
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| Series: | Dianzi Jishu Yingyong |
| Subjects: | |
| Online Access: | http://www.chinaaet.com/article/3000149450 |
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