Miniaturized Ku-band transceiver based on 3D integration technology
With silicon-based 3D integrated module and multilayer hybrid pressing printed circuit board(PCB) technique, a miniaturized Ku-band transceiver was designed, and meanwhile its principle project and approach were expounded. The transceiver employed 3D integrated structure. Radio frequency(RF) and int...
Saved in:
| Main Authors: | , , , |
|---|---|
| Format: | Article |
| Language: | zho |
| Published: |
National Computer System Engineering Research Institute of China
2022-05-01
|
| Series: | Dianzi Jishu Yingyong |
| Subjects: | |
| Online Access: | http://www.chinaaet.com/article/3000149450 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| _version_ | 1849425740454428672 |
|---|---|
| author | Liu Haodong Wu Hongjiang Yu Xiaohui Ma Zhangang |
| author_facet | Liu Haodong Wu Hongjiang Yu Xiaohui Ma Zhangang |
| author_sort | Liu Haodong |
| collection | DOAJ |
| description | With silicon-based 3D integrated module and multilayer hybrid pressing printed circuit board(PCB) technique, a miniaturized Ku-band transceiver was designed, and meanwhile its principle project and approach were expounded. The transceiver employed 3D integrated structure. Radio frequency(RF) and intermediate frequency(IF) chips and their periphery circuits were integrated in 3D heterogeneous integrated module. Outer circuit board was made of a mixed-laminated multi-layer PCB. The transceiver used ball grid array(BGA) to connect 3D module and PCB. Signal transmission structure was optimized to reduce transmission loss and improve isolation among the channels. Product test indicates that the transceiver meet the requirements of inter-channel amplitude consistency, intra-band flatness, noise factor and other indicators. Besides, the transceiver has conformed to practical needs such as miniaturization, high integration, high consistency and high producibility. |
| format | Article |
| id | doaj-art-8fd2e7c626b74adf8879feda1e9b1865 |
| institution | Kabale University |
| issn | 0258-7998 |
| language | zho |
| publishDate | 2022-05-01 |
| publisher | National Computer System Engineering Research Institute of China |
| record_format | Article |
| series | Dianzi Jishu Yingyong |
| spelling | doaj-art-8fd2e7c626b74adf8879feda1e9b18652025-08-20T03:29:39ZzhoNational Computer System Engineering Research Institute of ChinaDianzi Jishu Yingyong0258-79982022-05-0148511912410.16157/j.issn.0258-7998.2226773000149450Miniaturized Ku-band transceiver based on 3D integration technologyLiu Haodong0Wu Hongjiang1Yu Xiaohui2Ma Zhangang3The 13th Research Institute，CETC，Shijiazhuang 050051，ChinaThe 13th Research Institute，CETC，Shijiazhuang 050051，ChinaThe 13th Research Institute，CETC，Shijiazhuang 050051，ChinaThe 13th Research Institute，CETC，Shijiazhuang 050051，ChinaWith silicon-based 3D integrated module and multilayer hybrid pressing printed circuit board(PCB) technique, a miniaturized Ku-band transceiver was designed, and meanwhile its principle project and approach were expounded. The transceiver employed 3D integrated structure. Radio frequency(RF) and intermediate frequency(IF) chips and their periphery circuits were integrated in 3D heterogeneous integrated module. Outer circuit board was made of a mixed-laminated multi-layer PCB. The transceiver used ball grid array(BGA) to connect 3D module and PCB. Signal transmission structure was optimized to reduce transmission loss and improve isolation among the channels. Product test indicates that the transceiver meet the requirements of inter-channel amplitude consistency, intra-band flatness, noise factor and other indicators. Besides, the transceiver has conformed to practical needs such as miniaturization, high integration, high consistency and high producibility.http://www.chinaaet.com/article/30001494503d integratedtransceiverku-bandvertical interconnection |
| spellingShingle | Liu Haodong Wu Hongjiang Yu Xiaohui Ma Zhangang Miniaturized Ku-band transceiver based on 3D integration technology Dianzi Jishu Yingyong 3d integrated transceiver ku-band vertical interconnection |
| title | Miniaturized Ku-band transceiver based on 3D integration technology |
| title_full | Miniaturized Ku-band transceiver based on 3D integration technology |
| title_fullStr | Miniaturized Ku-band transceiver based on 3D integration technology |
| title_full_unstemmed | Miniaturized Ku-band transceiver based on 3D integration technology |
| title_short | Miniaturized Ku-band transceiver based on 3D integration technology |
| title_sort | miniaturized ku band transceiver based on 3d integration technology |
| topic | 3d integrated transceiver ku-band vertical interconnection |
| url | http://www.chinaaet.com/article/3000149450 |
| work_keys_str_mv | AT liuhaodong miniaturizedkubandtransceiverbasedon3dintegrationtechnology AT wuhongjiang miniaturizedkubandtransceiverbasedon3dintegrationtechnology AT yuxiaohui miniaturizedkubandtransceiverbasedon3dintegrationtechnology AT mazhangang miniaturizedkubandtransceiverbasedon3dintegrationtechnology |