Measurement of Thermal Characteristics for IGBT Module and Thermal Characteristics Analysis of Its Inside Structure
Thermal characteristics of IGBT module structure are easily influenced by outside conditions, such as changes of packing technology or raw material performance. In this paper, structure function was used to obtain the junction thermal resistance inside module via practical calculation and test. Then...
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| Main Authors: | , , |
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| Format: | Article |
| Language: | zho |
| Published: |
Editorial Office of Control and Information Technology
2016-01-01
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| Series: | Kongzhi Yu Xinxi Jishu |
| Subjects: | |
| Online Access: | http://ctet.csrzic.com/thesisDetails#10.13889/j.issn.2095-3631.2016.02.006 |
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