The Correlation Between Cu/Sn Ratios and the Formation Speed of IMC-Cu Composite Micro Solder Joints
In order to study the effect of different Cu/Sn ratios on the IMC-Cu interface behavior of composite micro solder joints, this article uses a combination of Transient Liquid Phase Welding and pressure,using foamed copper, pure Sn and Cu substrates as raw materials to prepare IMC-Cu composite micro s...
Saved in:
| Main Authors: | , , |
|---|---|
| Format: | Article |
| Language: | zho |
| Published: |
Harbin University of Science and Technology Publications
2021-12-01
|
| Series: | Journal of Harbin University of Science and Technology |
| Subjects: | |
| Online Access: | https://hlgxb.hrbust.edu.cn/#/digest?ArticleID=2044 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| _version_ | 1850052982958194688 |
|---|---|
| author | SUN Feng-lian LI Wen-peng PAN Zhen |
| author_facet | SUN Feng-lian LI Wen-peng PAN Zhen |
| author_sort | SUN Feng-lian |
| collection | DOAJ |
| description | In order to study the effect of different Cu/Sn ratios on the IMC-Cu interface behavior of composite micro solder joints, this article uses a combination of Transient Liquid Phase Welding and pressure,using foamed copper, pure Sn and Cu substrates as raw materials to prepare IMC-Cu composite micro solder joints.The effect of different Cu/Sn ratio on the growth behavior of composite micro solder joint IMC was studied.The results show that the ratio of Cu/Sn has a significant effect on the growth behavior of IMC in composite solder joints.As the Cu content in the solder joint increases, the growth rate of the overall thickness of the IMC increases.Reducing the Sn content in the composite micro solder joint is beneficial to the growth of Cu3Sn at the reaction interface.The time to obtain all Cu3Sn-Cu composite micro solder joints decreases with the decrease of Sn content in the solder joints.Under the same welding conditions.When the bonding time is 25 minutes, the full Cu3Sn joint is formed first when the Sn content in the composite micro solder joint is 20%, which is 20% shorter than the bonding time when the Sn content is 40%.When the Sn content is in the range of 20%-40%, with the decrease of the Sn content in the solder joints, the growth rate of Cu3Sn increases, and the time to obtain all Cu3Sn-Cu composite micro solder joints is shortened. |
| format | Article |
| id | doaj-art-8d4a7fa608314e1ca52a60e497bbfcb2 |
| institution | DOAJ |
| issn | 1007-2683 |
| language | zho |
| publishDate | 2021-12-01 |
| publisher | Harbin University of Science and Technology Publications |
| record_format | Article |
| series | Journal of Harbin University of Science and Technology |
| spelling | doaj-art-8d4a7fa608314e1ca52a60e497bbfcb22025-08-20T02:52:41ZzhoHarbin University of Science and Technology PublicationsJournal of Harbin University of Science and Technology1007-26832021-12-01260612413010.15938/j.jhust.2021.06.017The Correlation Between Cu/Sn Ratios and the Formation Speed of IMC-Cu Composite Micro Solder JointsSUN Feng-lian0LI Wen-peng1PAN Zhen2School of Material Science and Engineering, Harbin University of Science and Technology, Harbin 150080,ChinaSchool of Material Science and Engineering, Harbin University of Science and Technology, Harbin 150080,ChinaSchool of Material Science and Engineering, Harbin University of Science and Technology, Harbin 150080,ChinaIn order to study the effect of different Cu/Sn ratios on the IMC-Cu interface behavior of composite micro solder joints, this article uses a combination of Transient Liquid Phase Welding and pressure,using foamed copper, pure Sn and Cu substrates as raw materials to prepare IMC-Cu composite micro solder joints.The effect of different Cu/Sn ratio on the growth behavior of composite micro solder joint IMC was studied.The results show that the ratio of Cu/Sn has a significant effect on the growth behavior of IMC in composite solder joints.As the Cu content in the solder joint increases, the growth rate of the overall thickness of the IMC increases.Reducing the Sn content in the composite micro solder joint is beneficial to the growth of Cu3Sn at the reaction interface.The time to obtain all Cu3Sn-Cu composite micro solder joints decreases with the decrease of Sn content in the solder joints.Under the same welding conditions.When the bonding time is 25 minutes, the full Cu3Sn joint is formed first when the Sn content in the composite micro solder joint is 20%, which is 20% shorter than the bonding time when the Sn content is 40%.When the Sn content is in the range of 20%-40%, with the decrease of the Sn content in the solder joints, the growth rate of Cu3Sn increases, and the time to obtain all Cu3Sn-Cu composite micro solder joints is shortened.https://hlgxb.hrbust.edu.cn/#/digest?ArticleID=2044imc-cu composite micro solder jointfoamed coppercu/sn ratiomicrostructure |
| spellingShingle | SUN Feng-lian LI Wen-peng PAN Zhen The Correlation Between Cu/Sn Ratios and the Formation Speed of IMC-Cu Composite Micro Solder Joints Journal of Harbin University of Science and Technology imc-cu composite micro solder joint foamed copper cu/sn ratio microstructure |
| title | The Correlation Between Cu/Sn Ratios and the Formation Speed of IMC-Cu Composite Micro Solder Joints |
| title_full | The Correlation Between Cu/Sn Ratios and the Formation Speed of IMC-Cu Composite Micro Solder Joints |
| title_fullStr | The Correlation Between Cu/Sn Ratios and the Formation Speed of IMC-Cu Composite Micro Solder Joints |
| title_full_unstemmed | The Correlation Between Cu/Sn Ratios and the Formation Speed of IMC-Cu Composite Micro Solder Joints |
| title_short | The Correlation Between Cu/Sn Ratios and the Formation Speed of IMC-Cu Composite Micro Solder Joints |
| title_sort | correlation between cu sn ratios and the formation speed of imc cu composite micro solder joints |
| topic | imc-cu composite micro solder joint foamed copper cu/sn ratio microstructure |
| url | https://hlgxb.hrbust.edu.cn/#/digest?ArticleID=2044 |
| work_keys_str_mv | AT sunfenglian thecorrelationbetweencusnratiosandtheformationspeedofimccucompositemicrosolderjoints AT liwenpeng thecorrelationbetweencusnratiosandtheformationspeedofimccucompositemicrosolderjoints AT panzhen thecorrelationbetweencusnratiosandtheformationspeedofimccucompositemicrosolderjoints AT sunfenglian correlationbetweencusnratiosandtheformationspeedofimccucompositemicrosolderjoints AT liwenpeng correlationbetweencusnratiosandtheformationspeedofimccucompositemicrosolderjoints AT panzhen correlationbetweencusnratiosandtheformationspeedofimccucompositemicrosolderjoints |