Effect of grain size on the interface deformation mechanism and mechanical properties of polycrystalline Cu/Al2Cu/al layered composite materials: A molecular dynamics simulation

Effect of grain size on the interface deformation mechanism and mechanical properties of polycrystalline Cu/Al2Cu/al layered composite materials: A molecular dynamics simulation

Molecular dynamics simulations were first employed to investigate effect of grain Size(D = 6–15 nm) on the interface deformation mechanism and mechanical properties of polycrystalline Cu/Al2Cu/Al layered Composite Materials. The results showed that tensile strength decreased significantly with incre...

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Bibliographic Details
Main Authors: Hui Zhang, Aiqin Wang, Aiqiong Pan, Jingpei Xie, Wei Yang
Format: Article
Language:English
Published: Elsevier 2025-05-01
Series:Journal of Materials Research and Technology
Subjects:
Cu/Al2Cu/Al interface
Deformation mechanism
Mechanical properties
Molecular dynamics
Grain size
Online Access:http://www.sciencedirect.com/science/article/pii/S2238785425012384
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