Study on the Motion Trajectory of Abrasives and Surface Improvement Mechanism in Ultrasonic-Assisted Diamond Wire Sawing Monocrystalline Silicon

Study on the Motion Trajectory of Abrasives and Surface Improvement Mechanism in Ultrasonic-Assisted Diamond Wire Sawing Monocrystalline Silicon

The surface quality of diamond wire sawing (DWS) wafers directly affects the efficiency and yield of subsequent processing steps. This paper investigates the motion trajectory of abrasives in ultrasonic-assisted diamond wire sawing (UADWS) and its mechanism for improving surface quality. The influen...

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Bibliographic Details
Main Authors: Honghao Li, Yufei Gao, Shengtan Hu, Zhipu Huo
Format: Article
Language:English
Published: MDPI AG 2025-06-01
Series:Micromachines
Subjects:
diamond wire saw
surface morphology
ultrasonic vibration
wire marks
Online Access:https://www.mdpi.com/2072-666X/16/6/708
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