IMC growth mechanism of Sn58Bi/Cu solder joints and its effect on the coarsening of the Bi phase

IMC growth mechanism of Sn58Bi/Cu solder joints and its effect on the coarsening of the Bi phase

In the use of Sn58Bi solder alloy, the abnormal enrichment and coarsening of Bi phase in solder joints and the excessive growth of IMC seriously affect its service reliability, among which, the IMC's reaction mechanism and evolution, the influence on the coarsening of the Bi phase within the so...

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Bibliographic Details
Main Authors: Min Shang, Chenyu Li, Yanchen Wang, Xiangxu Chen, Yuanbang Zhao, Jingli Ke, Yunpeng Wang, Haitao Ma, Jun Chen
Format: Article
Language:English
Published: Elsevier 2024-11-01
Series:Journal of Materials Research and Technology
Subjects:
Bi phase coarsening
Four interfacial reaction mechanisms
Mechanisms of IMC growth and evolution
Sn58Bi solder
Interfacial reaction
Online Access:http://www.sciencedirect.com/science/article/pii/S2238785424025341
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