APA (7th ed.) Citation

Shang, M., Li, C., Wang, Y., Chen, X., Zhao, Y., Ke, J., . . . Chen, J. IMC growth mechanism of Sn58Bi/Cu solder joints and its effect on the coarsening of the Bi phase. Elsevier.

Chicago Style (17th ed.) Citation

Shang, Min, Chenyu Li, Yanchen Wang, Xiangxu Chen, Yuanbang Zhao, Jingli Ke, Yunpeng Wang, Haitao Ma, and Jun Chen. IMC Growth Mechanism of Sn58Bi/Cu Solder Joints and Its Effect on the Coarsening of the Bi Phase. Elsevier.

MLA (9th ed.) Citation

Shang, Min, et al. IMC Growth Mechanism of Sn58Bi/Cu Solder Joints and Its Effect on the Coarsening of the Bi Phase. Elsevier.