A non-pyrophoric precursor for the low temperature deposition of metallic aluminium

Abstract The development of microelectronics prompts a search for precursors that can deposit conductive features. There is scarce research on Al as it is normally deposited using pyrophoric AlH3 etherates/aminates. Ligands can impart increased stability while maintaining the ability to deposit targ...

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Bibliographic Details
Main Authors: Erica N. Faria, Samuel P. Douglas, Shreya Mrig, Leonardo Santoni, Adam J. Clancy, Daniel W. N. Wilson, Caroline E. Knapp
Format: Article
Language:English
Published: Nature Portfolio 2025-07-01
Series:Nature Communications
Online Access:https://doi.org/10.1038/s41467-025-60786-2
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Summary:Abstract The development of microelectronics prompts a search for precursors that can deposit conductive features. There is scarce research on Al as it is normally deposited using pyrophoric AlH3 etherates/aminates. Ligands can impart increased stability while maintaining the ability to deposit target materials. Accordingly, we have engineered an aluminium complex that can undergo conversion to Al(0) at 100 °C. Our multi-step synthetic design features β-ketoiminate compounds, [Al(R-ketoiminate)2Cl] (R = Me, Et, i Pr, Ph and Mes, 1-5) as starting materials to obtain aluminium hydride complexes: the polymeric amidoalane Li[AlH2( i Pr-Hacnac)AlH3]n (6) and the imidoalane cluster [AlH2AlH2(N-Mes)3(AlH2 ּ Li(Et2O)2)2] (8). Decomposition of 8 into aluminium metal is observed when heated under vacuum at 100 °C and is confirmed by XRD, TEM, XPS. Deposition of a highly conductive film of Al is achieved from 8 after three weeks under nitrogen at room temperature. This represents a route to metallic aluminium involving non-pyrophoric precursors at low temperatures.
ISSN:2041-1723