Heat Removal from Bipolar Transistor by Loop Heat Pipe with Nickel and Copper Porous Structures
Loop heat pipes (LHPs) are used in many branches of industry, mainly for cooling of electrical elements and systems. The loop heat pipe is a vapour-liquid phase-change device that transfers heat from evaporator to condenser. One of the most important parts of the LHP is the porous wick structure. Th...
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| Format: | Article |
| Language: | English |
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Wiley
2014-01-01
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| Series: | The Scientific World Journal |
| Online Access: | http://dx.doi.org/10.1155/2014/724740 |
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| author | Patrik Nemec Martin Smitka Milan Malcho |
| author_facet | Patrik Nemec Martin Smitka Milan Malcho |
| author_sort | Patrik Nemec |
| collection | DOAJ |
| description | Loop heat pipes (LHPs) are used in many branches of industry, mainly for cooling of electrical elements and systems. The loop heat pipe is a vapour-liquid phase-change device that transfers heat from evaporator to condenser. One of the most important parts of the LHP is the porous wick structure. The wick structure provides capillary force to circulate the working fluid. To achieve good thermal performance of LHP, capillary wicks with high permeability and porosity and fine pore radius are expected. The aim of this work was to develop porous structures from copper and nickel powder with different grain sizes. For experiment copper powder with grain size of 50 and 100 μm and nickel powder with grain size of 10 and 25 μm were used. Analysis of these porous structures and LHP design are described in the paper. And the measurements’ influences of porous structures in LHP on heat removal from the insulated gate bipolar transistor (IGBT) have been made. |
| format | Article |
| id | doaj-art-8a3e8f4acd594e25a6f1f3a8b84d95a3 |
| institution | Kabale University |
| issn | 2356-6140 1537-744X |
| language | English |
| publishDate | 2014-01-01 |
| publisher | Wiley |
| record_format | Article |
| series | The Scientific World Journal |
| spelling | doaj-art-8a3e8f4acd594e25a6f1f3a8b84d95a32025-08-20T03:37:50ZengWileyThe Scientific World Journal2356-61401537-744X2014-01-01201410.1155/2014/724740724740Heat Removal from Bipolar Transistor by Loop Heat Pipe with Nickel and Copper Porous StructuresPatrik Nemec0Martin Smitka1Milan Malcho2Department of Power Engineering, Faculty of Mechanical Engineering, University of Žilina, Univerzitna 1, 01026 Žilina, SlovakiaDepartment of Power Engineering, Faculty of Mechanical Engineering, University of Žilina, Univerzitna 1, 01026 Žilina, SlovakiaDepartment of Power Engineering, Faculty of Mechanical Engineering, University of Žilina, Univerzitna 1, 01026 Žilina, SlovakiaLoop heat pipes (LHPs) are used in many branches of industry, mainly for cooling of electrical elements and systems. The loop heat pipe is a vapour-liquid phase-change device that transfers heat from evaporator to condenser. One of the most important parts of the LHP is the porous wick structure. The wick structure provides capillary force to circulate the working fluid. To achieve good thermal performance of LHP, capillary wicks with high permeability and porosity and fine pore radius are expected. The aim of this work was to develop porous structures from copper and nickel powder with different grain sizes. For experiment copper powder with grain size of 50 and 100 μm and nickel powder with grain size of 10 and 25 μm were used. Analysis of these porous structures and LHP design are described in the paper. And the measurements’ influences of porous structures in LHP on heat removal from the insulated gate bipolar transistor (IGBT) have been made.http://dx.doi.org/10.1155/2014/724740 |
| spellingShingle | Patrik Nemec Martin Smitka Milan Malcho Heat Removal from Bipolar Transistor by Loop Heat Pipe with Nickel and Copper Porous Structures The Scientific World Journal |
| title | Heat Removal from Bipolar Transistor by Loop Heat Pipe with Nickel and Copper Porous Structures |
| title_full | Heat Removal from Bipolar Transistor by Loop Heat Pipe with Nickel and Copper Porous Structures |
| title_fullStr | Heat Removal from Bipolar Transistor by Loop Heat Pipe with Nickel and Copper Porous Structures |
| title_full_unstemmed | Heat Removal from Bipolar Transistor by Loop Heat Pipe with Nickel and Copper Porous Structures |
| title_short | Heat Removal from Bipolar Transistor by Loop Heat Pipe with Nickel and Copper Porous Structures |
| title_sort | heat removal from bipolar transistor by loop heat pipe with nickel and copper porous structures |
| url | http://dx.doi.org/10.1155/2014/724740 |
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