Design and Fabrication of Silicon Pressure Sensors Based on Wet Etching Technology
This paper presents a novel silicon-based piezoresistive pressure sensor composed of a silicon layer with sensing elements and a glass cover for hermetic packaging. Unlike conventional designs, this study employs numerical simulation to analyze the influence of varying roughness levels of the sensit...
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| Main Authors: | Fengchao Li, Shijin Yan, Cheng Lei, Dandan Wang, Xi Wei, Jiangang Yu, Yongwei Li, Pengfei Ji, Qiulin Tan, Ting Liang |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2025-04-01
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| Series: | Micromachines |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2072-666X/16/5/516 |
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