Stress-Strength Interference Model for the Optimization of Test Coupon Engineering for Microvia Reliability
The demand in the automobile electronic industry for compact printed circuit boards requires highly reliable microvias that work as an interconnect among the conducting layers of printed circuit boards. To meet industry needs, researchers have developed different testing coupons to capture the early...
Saved in:
| Main Authors: | , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
IEEE
2025-01-01
|
| Series: | IEEE Open Journal of Power Electronics |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/11059317/ |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| _version_ | 1849320965568200704 |
|---|---|
| author | Syed Mujahid Abbas Wahaj Abbas Awan Muhammad Imran Haider Heba G. Mohamed |
| author_facet | Syed Mujahid Abbas Wahaj Abbas Awan Muhammad Imran Haider Heba G. Mohamed |
| author_sort | Syed Mujahid Abbas |
| collection | DOAJ |
| description | The demand in the automobile electronic industry for compact printed circuit boards requires highly reliable microvias that work as an interconnect among the conducting layers of printed circuit boards. To meet industry needs, researchers have developed different testing coupons to capture the early failure of microvias using accelerated testing. However, the percentage of failing microvias is insignificant when considering the failure phenomenon. It highlights the need for a statistical model that can give a significant likelihood of failure microvias that can be reviewed for reliability studies. In this paper, we have developed a statistical test model of microvia using the stress-strength interference method to enhance the possibility of microvia failure to investigate the phenomenon of failure during thermomechanical loading. Finite element models were developed using the design of the experiment technique using the Taguchi method. The results showed a 12% increase in the probability of microvia failure, providing sufficient room to find the behavior of microvias that fail. Moreover, the simulation modeling results correlate with the literature models to verify the accuracy of the model. |
| format | Article |
| id | doaj-art-88bf853fdc47452a94a021eb8affca7f |
| institution | Kabale University |
| issn | 2644-1314 |
| language | English |
| publishDate | 2025-01-01 |
| publisher | IEEE |
| record_format | Article |
| series | IEEE Open Journal of Power Electronics |
| spelling | doaj-art-88bf853fdc47452a94a021eb8affca7f2025-08-20T03:49:55ZengIEEEIEEE Open Journal of Power Electronics2644-13142025-01-0161190120110.1109/OJPEL.2025.358426311059317Stress-Strength Interference Model for the Optimization of Test Coupon Engineering for Microvia ReliabilitySyed Mujahid Abbas0https://orcid.org/0009-0008-2322-6199Wahaj Abbas Awan1https://orcid.org/0000-0003-4397-4211Muhammad Imran Haider2Heba G. Mohamed3https://orcid.org/0000-0002-0443-1049Department of Mechanical Engineering, Yokohama National University, Yokohama, JapanDepartment of Information and Communication Engineering, Chungbuk National University, Cheongju, South KoreaDepartment of Mechanical Engineering, Incheon National University, Incheon, South KoreaDepartment of Electrical Engineering, College of Engineering, Princess Nourah bint Abdulrahman University, Riyadh, Saudi ArabiaThe demand in the automobile electronic industry for compact printed circuit boards requires highly reliable microvias that work as an interconnect among the conducting layers of printed circuit boards. To meet industry needs, researchers have developed different testing coupons to capture the early failure of microvias using accelerated testing. However, the percentage of failing microvias is insignificant when considering the failure phenomenon. It highlights the need for a statistical model that can give a significant likelihood of failure microvias that can be reviewed for reliability studies. In this paper, we have developed a statistical test model of microvia using the stress-strength interference method to enhance the possibility of microvia failure to investigate the phenomenon of failure during thermomechanical loading. Finite element models were developed using the design of the experiment technique using the Taguchi method. The results showed a 12% increase in the probability of microvia failure, providing sufficient room to find the behavior of microvias that fail. Moreover, the simulation modeling results correlate with the literature models to verify the accuracy of the model.https://ieeexplore.ieee.org/document/11059317/Failure analysisfinite element analysismechanical reliabilitymicroviaPCBsubstrates |
| spellingShingle | Syed Mujahid Abbas Wahaj Abbas Awan Muhammad Imran Haider Heba G. Mohamed Stress-Strength Interference Model for the Optimization of Test Coupon Engineering for Microvia Reliability IEEE Open Journal of Power Electronics Failure analysis finite element analysis mechanical reliability microvia PCB substrates |
| title | Stress-Strength Interference Model for the Optimization of Test Coupon Engineering for Microvia Reliability |
| title_full | Stress-Strength Interference Model for the Optimization of Test Coupon Engineering for Microvia Reliability |
| title_fullStr | Stress-Strength Interference Model for the Optimization of Test Coupon Engineering for Microvia Reliability |
| title_full_unstemmed | Stress-Strength Interference Model for the Optimization of Test Coupon Engineering for Microvia Reliability |
| title_short | Stress-Strength Interference Model for the Optimization of Test Coupon Engineering for Microvia Reliability |
| title_sort | stress strength interference model for the optimization of test coupon engineering for microvia reliability |
| topic | Failure analysis finite element analysis mechanical reliability microvia PCB substrates |
| url | https://ieeexplore.ieee.org/document/11059317/ |
| work_keys_str_mv | AT syedmujahidabbas stressstrengthinterferencemodelfortheoptimizationoftestcouponengineeringformicroviareliability AT wahajabbasawan stressstrengthinterferencemodelfortheoptimizationoftestcouponengineeringformicroviareliability AT muhammadimranhaider stressstrengthinterferencemodelfortheoptimizationoftestcouponengineeringformicroviareliability AT hebagmohamed stressstrengthinterferencemodelfortheoptimizationoftestcouponengineeringformicroviareliability |