Evolution of the Microstructure and Performance of Pd/Ag - Based Thick Conductors
Pd/Ag-based inks are probably the most commonly used conductors in thick-film hybrid technology. The evolution of the microstructure of these films was studied on samples fired with isochronal cycles at a peak temperature in the range from 300℃ up to 850℃. The samples were investigated by means of X...
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| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Wiley
1985-01-01
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| Series: | Active and Passive Electronic Components |
| Online Access: | http://dx.doi.org/10.1155/1985/21431 |
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| Summary: | Pd/Ag-based inks are probably the most commonly used conductors in thick-film hybrid technology. The
evolution of the microstructure of these films was studied on samples fired with isochronal cycles at a
peak temperature in the range from 300℃ up to 850℃. The samples were investigated by means of X-ray
diffraction, SEM and EDAX analysis techniques; the results of these analyses as well as those of
thermogravimetry (TG, DTG) and differential thermal analysis (DTA), enable one to obtain a clear
picture of the complex evolution of the microstructure of these conductors, which correlates quite strictly
with the performance of the films in terms of resistivity and adhesion. |
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| ISSN: | 0882-7516 1563-5031 |