Investigation of the Impact of Material Rheology on the Interlayer Bonding Performance of Solid Waste 3D-Printed Components

With the rapid advancement of 3D printing technology in low-carbon construction, the constructability of 3D printing materials has increasingly garnered attention. The constructability of these materials is intrinsically linked to their rheological properties. Therefore, this paper investigates the...

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Bibliographic Details
Main Authors: Yifan Li, Shuisheng Chen, Liuhua Yang, Chuan Guo, Zhentao Li, Youliang Chen
Format: Article
Language:English
Published: MDPI AG 2025-02-01
Series:Buildings
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Online Access:https://www.mdpi.com/2075-5309/15/5/780
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Summary:With the rapid advancement of 3D printing technology in low-carbon construction, the constructability of 3D printing materials has increasingly garnered attention. The constructability of these materials is intrinsically linked to their rheological properties. Therefore, this paper investigates the impact of additives, specifically hydroxypropyl methylcellulose (HPMC) and polycarboxylate superplasticizer (PCE), on the rheological properties of materials. The findings indicated that HPMC significantly increased both shear stress and apparent viscosity while also enhancing the thixotropic loop area. In contrast, PCE was found to reduce viscosity and yield stress, thereby improving fluidity and plasticity. The judicious incorporation of PCE (less than 0.003) and HPMC (less than 0.002) can enhance the rheological properties of the printing material, thereby improving the stability and interlayer bonding characteristics of the 3D printing structure. However, an excessive amount will result in a reduction in fluidity and cohesion, adversely impacting the printing quality. At this stage, the occurrence of cracks increases, which is detrimental to interlayer adhesion. Therefore, the judicious control of the proportions of PCE and HPMC can enhance the fluidity and viscosity of the material, thereby improving interlayer bonding strength and print quality.
ISSN:2075-5309