Analysis of microcracks at the edges of micro tapered holes machined by in-situ laser-assisted imprinting and its inhibition methods

Micro tapered holes find extensive use in various domains including detection, infusion, lighting, etc. In-situ Laser-assisted micro-imprinting (In-LAI) technology is an effective method for machining micro tapered holes. However, the problem of microcracks at the edge of the outlet of the micro tap...

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Main Authors: Siwei Meng, Guangfeng Shi, Jifeng Zhang, Dong Yao
Format: Article
Language:English
Published: Elsevier 2025-08-01
Series:Materials & Design
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Online Access:http://www.sciencedirect.com/science/article/pii/S0264127525007567
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author Siwei Meng
Guangfeng Shi
Jifeng Zhang
Dong Yao
author_facet Siwei Meng
Guangfeng Shi
Jifeng Zhang
Dong Yao
author_sort Siwei Meng
collection DOAJ
description Micro tapered holes find extensive use in various domains including detection, infusion, lighting, etc. In-situ Laser-assisted micro-imprinting (In-LAI) technology is an effective method for machining micro tapered holes. However, the problem of microcracks at the edge of the outlet of the micro tapered holes are difficult to control, which affects the service life and the use of the effect of the parts. In this study, by MD simulation, the accumulated high potential energy defects during the micro tapered holes forming process have been shown to be the main factor for micro-cracks germination; A mechanical model of T2 copper material fracture toughness with size effect and temperature dependence of R2 = 0.92906 has been established, which is in accordance with the Hall-Petch relation and is used to guide the selection of process parameters thresholds for suppressing micro-cracks germination. The results have shown that workpiece temperature is >600 K, indenter taper angle is less than 90°, and the grain size of the material is <4 μm. This study systematically realizes the machining of the high-quality micro tapered holes and contributes to the field of micro-forming, and laser assisted machining.
format Article
id doaj-art-86563159ee104ccfbdc307092b8f9832
institution DOAJ
issn 0264-1275
language English
publishDate 2025-08-01
publisher Elsevier
record_format Article
series Materials & Design
spelling doaj-art-86563159ee104ccfbdc307092b8f98322025-08-20T02:43:50ZengElsevierMaterials & Design0264-12752025-08-0125611433610.1016/j.matdes.2025.114336Analysis of microcracks at the edges of micro tapered holes machined by in-situ laser-assisted imprinting and its inhibition methodsSiwei Meng0Guangfeng Shi1Jifeng Zhang2Dong Yao3College of Mechanical and Electrical Engineering, Changchun University of Science and Technology, Changchun 130022, China; Chongqing Research Institute, Changchun University of Science and Technology, Chongqing 401135, ChinaCollege of Mechanical and Electrical Engineering, Changchun University of Science and Technology, Changchun 130022, China; Chongqing Research Institute, Changchun University of Science and Technology, Chongqing 401135, China; Corresponding author at: College of Mechanical and Electrical Engineering, Changchun University of Science and Technology, Changchun 130022, China.College of Mechanical and Electrical Engineering, Changchun University of Science and Technology, Changchun 130022, ChinaCollege of Mechanical and Electrical Engineering, Changchun University of Science and Technology, Changchun 130022, ChinaMicro tapered holes find extensive use in various domains including detection, infusion, lighting, etc. In-situ Laser-assisted micro-imprinting (In-LAI) technology is an effective method for machining micro tapered holes. However, the problem of microcracks at the edge of the outlet of the micro tapered holes are difficult to control, which affects the service life and the use of the effect of the parts. In this study, by MD simulation, the accumulated high potential energy defects during the micro tapered holes forming process have been shown to be the main factor for micro-cracks germination; A mechanical model of T2 copper material fracture toughness with size effect and temperature dependence of R2 = 0.92906 has been established, which is in accordance with the Hall-Petch relation and is used to guide the selection of process parameters thresholds for suppressing micro-cracks germination. The results have shown that workpiece temperature is >600 K, indenter taper angle is less than 90°, and the grain size of the material is <4 μm. This study systematically realizes the machining of the high-quality micro tapered holes and contributes to the field of micro-forming, and laser assisted machining.http://www.sciencedirect.com/science/article/pii/S0264127525007567MicrocracksMicro tapered holesIn-situ laser-assisted imprintingMolecular dynamics
spellingShingle Siwei Meng
Guangfeng Shi
Jifeng Zhang
Dong Yao
Analysis of microcracks at the edges of micro tapered holes machined by in-situ laser-assisted imprinting and its inhibition methods
Materials & Design
Microcracks
Micro tapered holes
In-situ laser-assisted imprinting
Molecular dynamics
title Analysis of microcracks at the edges of micro tapered holes machined by in-situ laser-assisted imprinting and its inhibition methods
title_full Analysis of microcracks at the edges of micro tapered holes machined by in-situ laser-assisted imprinting and its inhibition methods
title_fullStr Analysis of microcracks at the edges of micro tapered holes machined by in-situ laser-assisted imprinting and its inhibition methods
title_full_unstemmed Analysis of microcracks at the edges of micro tapered holes machined by in-situ laser-assisted imprinting and its inhibition methods
title_short Analysis of microcracks at the edges of micro tapered holes machined by in-situ laser-assisted imprinting and its inhibition methods
title_sort analysis of microcracks at the edges of micro tapered holes machined by in situ laser assisted imprinting and its inhibition methods
topic Microcracks
Micro tapered holes
In-situ laser-assisted imprinting
Molecular dynamics
url http://www.sciencedirect.com/science/article/pii/S0264127525007567
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AT guangfengshi analysisofmicrocracksattheedgesofmicrotaperedholesmachinedbyinsitulaserassistedimprintinganditsinhibitionmethods
AT jifengzhang analysisofmicrocracksattheedgesofmicrotaperedholesmachinedbyinsitulaserassistedimprintinganditsinhibitionmethods
AT dongyao analysisofmicrocracksattheedgesofmicrotaperedholesmachinedbyinsitulaserassistedimprintinganditsinhibitionmethods