Comprehensive enhancement of mechanical strength, thermal conductivity, and oxidation resistance of W/Cu diffusion bonding joint via heterogeneous interface configuration theoretical design

Comprehensive enhancement of mechanical strength, thermal conductivity, and oxidation resistance of W/Cu diffusion bonding joint via heterogeneous interface configuration theoretical design

To improve the Plasma-facing components (PFC) composed by plasma-facing materials (W) and heat-sink materials (Cu) in thermonuclear reactors, the mechanical strength, thermal conductivity, and oxidation resistance of W/Cu diffusion bonding joint were improved by heterogeneous interface configuration...

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Bibliographic Details
Main Authors:	Zida Wang, Jinghao Xu, Qi Wu, Shuwen Shang, Wei Shao, Jihua Huang, Shuhai Chen, Zheng Ye, Wanli Wang, Jian Yang
Format:	Article
Language:	English
Published:	Elsevier 2025-07-01
Series:	Journal of Materials Research and Technology
Subjects:	First-principles calculation Heterogeneous interface Mechanical strength Thermal conductivity Diffusion energy barrier Oxidation resistance
Online Access:	http://www.sciencedirect.com/science/article/pii/S2238785425016321
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