APA (7th ed.) Citation

Meng, S., Zhang, M., Han, Y., Liu, W., Ma, Y., & Cai, Q. Effect of bonding time on the interfacial microstructure and mechanical properties of diffusion bonded tungsten alloy/steel joints using CrFeCoNiCu high entropy alloy interlayer. Elsevier.

Chicago Style (17th ed.) Citation

Meng, Shangru, Mengxiang Zhang, Yifan Han, Wensheng Liu, Yunzhu Ma, and Qingshan Cai. Effect of Bonding Time on the Interfacial Microstructure and Mechanical Properties of Diffusion Bonded Tungsten Alloy/steel Joints Using CrFeCoNiCu High Entropy Alloy Interlayer. Elsevier.

MLA (9th ed.) Citation

Meng, Shangru, et al. Effect of Bonding Time on the Interfacial Microstructure and Mechanical Properties of Diffusion Bonded Tungsten Alloy/steel Joints Using CrFeCoNiCu High Entropy Alloy Interlayer. Elsevier.