Numerical and experimental investigation of heat transfer in a dimpled and petaled array tube with a coiled twisted tape and SiC nanofluid

Thermal efficiency challenges are common in absorber tube designs. This study proposes an innovative absorber tube featuring dimples and petal arrays on its surface, integrated with a coiled twisted tape, and circulating a 0.9 % volume concentration of silicon carbide (SiC)-enhanced nanofluid. Fixin...

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Main Authors: Hariam Luqman Azeez, Adnan Ibrahim, Banw Omer Ahmed, Sharul Sham Dol, Ali H.A. Al-Waeli, Mahmoud Jaber
Format: Article
Language:English
Published: Elsevier 2025-08-01
Series:Case Studies in Thermal Engineering
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Online Access:http://www.sciencedirect.com/science/article/pii/S2214157X25006094
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author Hariam Luqman Azeez
Adnan Ibrahim
Banw Omer Ahmed
Sharul Sham Dol
Ali H.A. Al-Waeli
Mahmoud Jaber
author_facet Hariam Luqman Azeez
Adnan Ibrahim
Banw Omer Ahmed
Sharul Sham Dol
Ali H.A. Al-Waeli
Mahmoud Jaber
author_sort Hariam Luqman Azeez
collection DOAJ
description Thermal efficiency challenges are common in absorber tube designs. This study proposes an innovative absorber tube featuring dimples and petal arrays on its surface, integrated with a coiled twisted tape, and circulating a 0.9 % volume concentration of silicon carbide (SiC)-enhanced nanofluid. Fixing heat flux at 1000 W/m2 and Reynold number between 720 and 5030, Computational Fluid Dynamics (CFD) was employed to optimize key dimple parameters, encompassing dimple lines number (ranging from 2 to 6), dimple diameter (1–5 mm), dimple height (0.8–2 mm), and dimple pitch distance (10–30 mm). Additionally, Thermohydraulic Performance Factor (THPF) assessment was conducted experimentally to examine the impact of petal arrays, coil, twisted tape, and three concentrations of SiC-enhanced nanofluid on the optimized dimple tube. The results indicate that a configuration with five dimple lines, a dimple diameter of 3 mm, a dimple height of 1.4 mm, and a dimple pitch distance of 10 mm provides optimal heat transfer augmentation. Furthermore, incorporating 0.9 % SiC with a coiled twisted tape into the optimized dimpled and petaled array tube design enhances the THPF by 71.1 %, demonstrating a substantial improvement in thermohydraulic performance.
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spelling doaj-art-82d78a59a38743dab46f07cfba4f85eb2025-08-20T03:47:33ZengElsevierCase Studies in Thermal Engineering2214-157X2025-08-017210634910.1016/j.csite.2025.106349Numerical and experimental investigation of heat transfer in a dimpled and petaled array tube with a coiled twisted tape and SiC nanofluidHariam Luqman Azeez0Adnan Ibrahim1Banw Omer Ahmed2Sharul Sham Dol3Ali H.A. Al-Waeli4Mahmoud Jaber5Solar Energy Research Institute, Universiti Kebangsaan Malaysia, Bangi, 43600, Selangor, MalaysiaSolar Energy Research Institute, Universiti Kebangsaan Malaysia, Bangi, 43600, Selangor, Malaysia; Corresponding author.Solar Energy Research Institute, Universiti Kebangsaan Malaysia, Bangi, 43600, Selangor, MalaysiaDepartment of Mechanical and Industrial Engineering, Abu Dhabi University, PO Box 59911, Abu Dhabi, United Arab EmiratesEngineering Department, American University of Iraq, Sulaimani, Kurdistan Region, Sulaimani, IraqSolar Energy Research Institute, Universiti Kebangsaan Malaysia, Bangi, 43600, Selangor, MalaysiaThermal efficiency challenges are common in absorber tube designs. This study proposes an innovative absorber tube featuring dimples and petal arrays on its surface, integrated with a coiled twisted tape, and circulating a 0.9 % volume concentration of silicon carbide (SiC)-enhanced nanofluid. Fixing heat flux at 1000 W/m2 and Reynold number between 720 and 5030, Computational Fluid Dynamics (CFD) was employed to optimize key dimple parameters, encompassing dimple lines number (ranging from 2 to 6), dimple diameter (1–5 mm), dimple height (0.8–2 mm), and dimple pitch distance (10–30 mm). Additionally, Thermohydraulic Performance Factor (THPF) assessment was conducted experimentally to examine the impact of petal arrays, coil, twisted tape, and three concentrations of SiC-enhanced nanofluid on the optimized dimple tube. The results indicate that a configuration with five dimple lines, a dimple diameter of 3 mm, a dimple height of 1.4 mm, and a dimple pitch distance of 10 mm provides optimal heat transfer augmentation. Furthermore, incorporating 0.9 % SiC with a coiled twisted tape into the optimized dimpled and petaled array tube design enhances the THPF by 71.1 %, demonstrating a substantial improvement in thermohydraulic performance.http://www.sciencedirect.com/science/article/pii/S2214157X25006094Dimple and petal arraysSilicon carbide enhanced nanofluidCoiled twisted tapeCFDTHPF
spellingShingle Hariam Luqman Azeez
Adnan Ibrahim
Banw Omer Ahmed
Sharul Sham Dol
Ali H.A. Al-Waeli
Mahmoud Jaber
Numerical and experimental investigation of heat transfer in a dimpled and petaled array tube with a coiled twisted tape and SiC nanofluid
Case Studies in Thermal Engineering
Dimple and petal arrays
Silicon carbide enhanced nanofluid
Coiled twisted tape
CFD
THPF
title Numerical and experimental investigation of heat transfer in a dimpled and petaled array tube with a coiled twisted tape and SiC nanofluid
title_full Numerical and experimental investigation of heat transfer in a dimpled and petaled array tube with a coiled twisted tape and SiC nanofluid
title_fullStr Numerical and experimental investigation of heat transfer in a dimpled and petaled array tube with a coiled twisted tape and SiC nanofluid
title_full_unstemmed Numerical and experimental investigation of heat transfer in a dimpled and petaled array tube with a coiled twisted tape and SiC nanofluid
title_short Numerical and experimental investigation of heat transfer in a dimpled and petaled array tube with a coiled twisted tape and SiC nanofluid
title_sort numerical and experimental investigation of heat transfer in a dimpled and petaled array tube with a coiled twisted tape and sic nanofluid
topic Dimple and petal arrays
Silicon carbide enhanced nanofluid
Coiled twisted tape
CFD
THPF
url http://www.sciencedirect.com/science/article/pii/S2214157X25006094
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