Failure behavior of polymer microelectrode arrays encapsulated with conventional ALD and 3D-ALI barriers
As implantable electronics become thinner, softer, and more flexible, there is an increasing need for encapsulation strategies which enable these next-generation devices to survive for sufficient durations in the implanted environment. Atomic layer deposited (ALD) films of metal oxides have been stu...
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| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Frontiers Media S.A.
2025-07-01
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| Series: | Frontiers in Bioengineering and Biotechnology |
| Subjects: | |
| Online Access: | https://www.frontiersin.org/articles/10.3389/fbioe.2025.1622927/full |
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