The Investigation of Copper Metalized AlN for High Voltage IGBT Module
According to the application requirements of high voltage IGBT module, the properties of copper metalized AlN is investigated such as front-side solder-ability, back-side solder-ability, front-side bonding-ability, insulation of substrates and modules. The test results have been discussed and analyz...
Saved in:
| Main Authors: | WU Yudong, WAN Zhengfen, PENG Yongdian |
|---|---|
| Format: | Article |
| Language: | zho |
| Published: |
Editorial Office of Control and Information Technology
2012-01-01
|
| Series: | Kongzhi Yu Xinxi Jishu |
| Subjects: | |
| Online Access: | http://ctet.csrzic.com/thesisDetails#10.13889/j.issn.2095-3631.2012.05.001 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Similar Items
-
Research on Partial Discharge Behavior of AlN Substrate in High Voltage IGBT Module
by: FANG Jie, et al.
Published: (2015-01-01) -
Research on Baseplate Soldering Process of High-voltage IGBT Module
Published: (2011-01-01) -
Technical Progress and Trend of Interconnection in IGBT Module
by: QINRong-zhen, et al.
Published: (2013-01-01) -
Thermal Performance Analysis of High-power IGBT Module Based on ANSYS
by: FANG Jie, et al.
Published: (2012-01-01) -
Research on the Reliability of Aluminum Nitride Ceramic Substrate for IGBT
by: QIAN Jianbo, et al.
Published: (2017-01-01)