Substrate Integrated Waveguide on Glass with Vacuum-Filled Tin Through Glass Vias for Millimeter-Wave Applications
This paper presents a novel approach to fabricate substrate integrated waveguides (SIWs) on glass substrates with tin (Sn) through glass vias (TGVs) tailored for millimeter-wave applications. The fabrication process employs a custom-designed vacuum suctioning system to rapidly fill precise TGV holes...
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| Format: | Article |
| Language: | English |
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MDPI AG
2024-12-01
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| Series: | Micromachines |
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| Online Access: | https://www.mdpi.com/2072-666X/16/1/12 |
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| author | Seung-Han Chung Ho-Sun Yeom Che-Heung Kim Yong-Kweon Kim Seung-Ki Lee Chang-Wook Baek Jae-Hyoung Park |
| author_facet | Seung-Han Chung Ho-Sun Yeom Che-Heung Kim Yong-Kweon Kim Seung-Ki Lee Chang-Wook Baek Jae-Hyoung Park |
| author_sort | Seung-Han Chung |
| collection | DOAJ |
| description | This paper presents a novel approach to fabricate substrate integrated waveguides (SIWs) on glass substrates with tin (Sn) through glass vias (TGVs) tailored for millimeter-wave applications. The fabrication process employs a custom-designed vacuum suctioning system to rapidly fill precise TGV holes in the glass substrate, which are formed by wafer-level glass reflow micromachining techniques with molten tin in a minute. This method offers a very fast and cost-effective alternative for complete via filling without voids compared to the conventional metallization techniques such as electroplating or sputtering. An SIW with a 3-dB cutoff frequency of 17.2 GHz was fabricated using the proposed process. The fabricated SIW shows an average insertion loss of 1.65 ± 0.54 dB across the 20–35 GHz range. These results highlight the potential of glass substrates with tin TGVs for fabricating millimeter-wave devices. |
| format | Article |
| id | doaj-art-821f808cad8d414b97f082d2364f505c |
| institution | Kabale University |
| issn | 2072-666X |
| language | English |
| publishDate | 2024-12-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Micromachines |
| spelling | doaj-art-821f808cad8d414b97f082d2364f505c2025-01-24T13:41:50ZengMDPI AGMicromachines2072-666X2024-12-011611210.3390/mi16010012Substrate Integrated Waveguide on Glass with Vacuum-Filled Tin Through Glass Vias for Millimeter-Wave ApplicationsSeung-Han Chung0Ho-Sun Yeom1Che-Heung Kim2Yong-Kweon Kim3Seung-Ki Lee4Chang-Wook Baek5Jae-Hyoung Park6Department of Electrical and Computer Engineering, Seoul National University, 1 Gwanak-ro, Gwanak-gu, Seoul 08826, Republic of KoreaDepartment of Foundry Engineering, Dankook University, Yongin 16890, Republic of KoreaDepartment of Electrical and Computer Engineering, Seoul National University, 1 Gwanak-ro, Gwanak-gu, Seoul 08826, Republic of KoreaDepartment of Electrical and Computer Engineering, Seoul National University, 1 Gwanak-ro, Gwanak-gu, Seoul 08826, Republic of KoreaDepartment of Semiconductor Convergence Engineering, Dankook University, Yongin 16890, Republic of KoreaSchool of Electrical and Electronics Engineering, Chung-Ang University, 84 Heukseok-ro, Dongjak-gu, Seoul 06974, Republic of KoreaDepartment of Foundry Engineering, Dankook University, Yongin 16890, Republic of KoreaThis paper presents a novel approach to fabricate substrate integrated waveguides (SIWs) on glass substrates with tin (Sn) through glass vias (TGVs) tailored for millimeter-wave applications. The fabrication process employs a custom-designed vacuum suctioning system to rapidly fill precise TGV holes in the glass substrate, which are formed by wafer-level glass reflow micromachining techniques with molten tin in a minute. This method offers a very fast and cost-effective alternative for complete via filling without voids compared to the conventional metallization techniques such as electroplating or sputtering. An SIW with a 3-dB cutoff frequency of 17.2 GHz was fabricated using the proposed process. The fabricated SIW shows an average insertion loss of 1.65 ± 0.54 dB across the 20–35 GHz range. These results highlight the potential of glass substrates with tin TGVs for fabricating millimeter-wave devices.https://www.mdpi.com/2072-666X/16/1/12substrate integrated waveguide (SIW)through glass via (TGV)tin (Sn) viasvacuum suctioning systemmicromachining |
| spellingShingle | Seung-Han Chung Ho-Sun Yeom Che-Heung Kim Yong-Kweon Kim Seung-Ki Lee Chang-Wook Baek Jae-Hyoung Park Substrate Integrated Waveguide on Glass with Vacuum-Filled Tin Through Glass Vias for Millimeter-Wave Applications Micromachines substrate integrated waveguide (SIW) through glass via (TGV) tin (Sn) vias vacuum suctioning system micromachining |
| title | Substrate Integrated Waveguide on Glass with Vacuum-Filled Tin Through Glass Vias for Millimeter-Wave Applications |
| title_full | Substrate Integrated Waveguide on Glass with Vacuum-Filled Tin Through Glass Vias for Millimeter-Wave Applications |
| title_fullStr | Substrate Integrated Waveguide on Glass with Vacuum-Filled Tin Through Glass Vias for Millimeter-Wave Applications |
| title_full_unstemmed | Substrate Integrated Waveguide on Glass with Vacuum-Filled Tin Through Glass Vias for Millimeter-Wave Applications |
| title_short | Substrate Integrated Waveguide on Glass with Vacuum-Filled Tin Through Glass Vias for Millimeter-Wave Applications |
| title_sort | substrate integrated waveguide on glass with vacuum filled tin through glass vias for millimeter wave applications |
| topic | substrate integrated waveguide (SIW) through glass via (TGV) tin (Sn) vias vacuum suctioning system micromachining |
| url | https://www.mdpi.com/2072-666X/16/1/12 |
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