Magnetic Properties of Fe/Cu Multilayers Prepared Using Pulsed-Current Electrodeposition

[Fe (tFe) nm/Cu (tCu) nm]N multilayer films were prepared using pulsed-current electrodeposition method. The role of the pulsed-current deposition and Fe and Cu layer thicknesses on the magnetic properties was investigated. The microstructure of the multilayer films is dependent on the thicknesses o...

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Bibliographic Details
Main Authors: B.R. Karki, Y. Ueda, C. Rizal
Format: Article
Language:English
Published: Sumy State University 2012-03-01
Series:Журнал нано- та електронної фізики
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Online Access:http://jnep.sumdu.edu.ua/download/numbers/2012/1/articles/jnep_2012_V4_01001.pdf
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Summary:[Fe (tFe) nm/Cu (tCu) nm]N multilayer films were prepared using pulsed-current electrodeposition method. The role of the pulsed-current deposition and Fe and Cu layer thicknesses on the magnetic properties was investigated. The microstructure of the multilayer films is dependent on the thicknesses of both the Fe and Cu layers. The saturation magnetization of the multilayers strongly correlated with the crystalline structure of Fe at the interface of Fe and Cu layers. <br> [Fe (tFe) nm/Cu (tCu) nm]N multilayer films were prepared using pulsed-current electrodeposition method. The role of the pulsed-current deposition and Fe and Cu layer thicknesses on the magnetic properties was investigated. The microstructure of the multilayer films is dependent on the thicknesses of both the Fe and Cu layers. The saturation magnetization of the multilayers strongly correlated with the crystalline structure of Fe at the interface of Fe and Cu layers. <br> [Fe (tFe) nm/Cu (tCu) nm]N multilayer films were prepared using pulsed-current electrodeposition method. The role of the pulsed-current deposition and Fe and Cu layer thicknesses on the magnetic properties was investigated. The microstructure of the multilayer films is dependent on the thicknesses of both the Fe and Cu layers. The saturation magnetization of the multilayers strongly correlated with the crystalline structure of Fe at the interface of Fe and Cu layers.
ISSN:2077-6772