Fast solid-phase bonding based on indium film-modified copper crystal structure
Abstract The special shape of Cu/In layer and ultrasonic vibration are used to realize fast bonding at room temperature, thus solving the problems of high thermal stress and signal delay caused by high temperature in the traditional reflow soldering process. The indium film-modified copper crystal m...
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| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Nature Portfolio
2025-05-01
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| Series: | Scientific Reports |
| Subjects: | |
| Online Access: | https://doi.org/10.1038/s41598-025-02798-y |
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