Recovery of Silicon Kerf Through Oxidative Cleaning and Drying Process
High quantity of slurries, kerf, are generated during ingot wafering and represent up to 40% of the silicon in weight. The highly pure silicon contained in kerf is contaminated with organics, metal impurities, water and an oxide layer. The recovery of the silicon could be an efficient way to reduce...
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| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
TIB Open Publishing
2025-02-01
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| Series: | SiliconPV Conference Proceedings |
| Subjects: | |
| Online Access: | https://www.tib-op.org/ojs/index.php/siliconpv/article/view/1301 |
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