Research on the Trajectory and Relative Speed of a Single-Sided Chemical Mechanical Polishing Machine
This study establishes a bidirectional kinematic analysis framework for single-sided chemical mechanical polishing systems through innovative coordinate transformation synergies (rotational and translational). To address three critical gaps in existing research, interaction dynamics for both pad–waf...
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MDPI AG
2025-04-01
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| Online Access: | https://www.mdpi.com/2072-666X/16/4/450 |
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| author | Guoqing Ye Zhenqiang Yao |
| author_facet | Guoqing Ye Zhenqiang Yao |
| author_sort | Guoqing Ye |
| collection | DOAJ |
| description | This study establishes a bidirectional kinematic analysis framework for single-sided chemical mechanical polishing systems through innovative coordinate transformation synergies (rotational and translational). To address three critical gaps in existing research, interaction dynamics for both pad–wafer and abrasive–wafer interfaces are systematically derived via 5-inch silicon wafers. Key advancements include (1) the development of closed-form trajectory equations for resolving multibody tribological interactions, (2) vector-based relative velocity quantification with 17 × 17 grid 3D visualization, and (3) first-principle parametric mapping of velocity nonuniformity (NUV = 0–0.42) across 0–80 rpm operational regimes. Numerical simulations reveal two fundamental regimes: near-unity rotational speed ratios (ω<sub>P</sub>/ω<sub>C</sub> = [0.95, 1) and (1, 1.05]) generate optimal spiral trajectories that achieve 95% surface coverage, whereas integer multiples produce stable relative velocities (1.75 m/s at 60 rpm). Experimental validation demonstrated 0.3 μm/min removal rates with <1 μm nonuniformity under optimized conditions, which was attributable to velocity stabilization effects. The methodology exhibits inherent extensibility to high-speed operations (>80 rpm) and alternative polishing configurations through coordinate transformation adaptability. This work provides a systematic derivation protocol for abrasive trajectory analysis, a visualization paradigm for velocity optimization, and quantitative guidelines for precision process control—advancing beyond current empirical approaches in surface finishing technology. |
| format | Article |
| id | doaj-art-7a550add8c604d00a812d53313b08161 |
| institution | OA Journals |
| issn | 2072-666X |
| language | English |
| publishDate | 2025-04-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Micromachines |
| spelling | doaj-art-7a550add8c604d00a812d53313b081612025-08-20T02:28:27ZengMDPI AGMicromachines2072-666X2025-04-0116445010.3390/mi16040450Research on the Trajectory and Relative Speed of a Single-Sided Chemical Mechanical Polishing MachineGuoqing Ye0Zhenqiang Yao1School of Mechanical Engineering, Shanghai Jiao Tong University, Shanghai 200240, ChinaSchool of Mechanical Engineering, Shanghai Jiao Tong University, Shanghai 200240, ChinaThis study establishes a bidirectional kinematic analysis framework for single-sided chemical mechanical polishing systems through innovative coordinate transformation synergies (rotational and translational). To address three critical gaps in existing research, interaction dynamics for both pad–wafer and abrasive–wafer interfaces are systematically derived via 5-inch silicon wafers. Key advancements include (1) the development of closed-form trajectory equations for resolving multibody tribological interactions, (2) vector-based relative velocity quantification with 17 × 17 grid 3D visualization, and (3) first-principle parametric mapping of velocity nonuniformity (NUV = 0–0.42) across 0–80 rpm operational regimes. Numerical simulations reveal two fundamental regimes: near-unity rotational speed ratios (ω<sub>P</sub>/ω<sub>C</sub> = [0.95, 1) and (1, 1.05]) generate optimal spiral trajectories that achieve 95% surface coverage, whereas integer multiples produce stable relative velocities (1.75 m/s at 60 rpm). Experimental validation demonstrated 0.3 μm/min removal rates with <1 μm nonuniformity under optimized conditions, which was attributable to velocity stabilization effects. The methodology exhibits inherent extensibility to high-speed operations (>80 rpm) and alternative polishing configurations through coordinate transformation adaptability. This work provides a systematic derivation protocol for abrasive trajectory analysis, a visualization paradigm for velocity optimization, and quantitative guidelines for precision process control—advancing beyond current empirical approaches in surface finishing technology.https://www.mdpi.com/2072-666X/16/4/450trajectoryrelative speedchemical mechanical polishing (CMP)single-sided polishing machinesilicon wafer |
| spellingShingle | Guoqing Ye Zhenqiang Yao Research on the Trajectory and Relative Speed of a Single-Sided Chemical Mechanical Polishing Machine Micromachines trajectory relative speed chemical mechanical polishing (CMP) single-sided polishing machine silicon wafer |
| title | Research on the Trajectory and Relative Speed of a Single-Sided Chemical Mechanical Polishing Machine |
| title_full | Research on the Trajectory and Relative Speed of a Single-Sided Chemical Mechanical Polishing Machine |
| title_fullStr | Research on the Trajectory and Relative Speed of a Single-Sided Chemical Mechanical Polishing Machine |
| title_full_unstemmed | Research on the Trajectory and Relative Speed of a Single-Sided Chemical Mechanical Polishing Machine |
| title_short | Research on the Trajectory and Relative Speed of a Single-Sided Chemical Mechanical Polishing Machine |
| title_sort | research on the trajectory and relative speed of a single sided chemical mechanical polishing machine |
| topic | trajectory relative speed chemical mechanical polishing (CMP) single-sided polishing machine silicon wafer |
| url | https://www.mdpi.com/2072-666X/16/4/450 |
| work_keys_str_mv | AT guoqingye researchonthetrajectoryandrelativespeedofasinglesidedchemicalmechanicalpolishingmachine AT zhenqiangyao researchonthetrajectoryandrelativespeedofasinglesidedchemicalmechanicalpolishingmachine |