Carvalho, C. N., Lanza, M. D. S., Dourado, L. G., Carvalho, E. M., & Bauer, J. Impact of Solvent Evaporation and Curing Protocol on Degree of Conversion of Etch-and-Rinse and Multimode Adhesives Systems. Wiley.
Chicago Style (17th ed.) CitationCarvalho, Ceci Nunes, Marcos Daniel Septímio Lanza, Letícia Gomes Dourado, Edilausson Moreno Carvalho, and José Bauer. Impact of Solvent Evaporation and Curing Protocol on Degree of Conversion of Etch-and-Rinse and Multimode Adhesives Systems. Wiley.
MLA (9th ed.) CitationCarvalho, Ceci Nunes, et al. Impact of Solvent Evaporation and Curing Protocol on Degree of Conversion of Etch-and-Rinse and Multimode Adhesives Systems. Wiley.
Warning: These citations may not always be 100% accurate.