Wavelength-Multiplexed Duplex Transceiver Based on III-V/Si Hybrid Integration for Off-Chip and On-Chip Optical Interconnects
A six-channel wavelength-division-multiplexed optical transceiver with a compact footprint of 1.5 <inline-formula> <tex-math notation="LaTeX">$\times$</tex-math></inline-formula> 0.65 mm<sup>2</sup> for off-chip and on-chip interconnects is demonstrated...
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| Format: | Article |
| Language: | English |
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IEEE
2016-01-01
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| Series: | IEEE Photonics Journal |
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| Online Access: | https://ieeexplore.ieee.org/document/7378272/ |
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| author | Kaixuan Chen Qiangsheng Huang Jianhao Zhang Jianxin Cheng Xin Fu Chenzhao Zhang Keqi Ma Yaocheng Shi Dries Van Thourhout Gunther Roelkens Liu Liu Sailing He |
| author_facet | Kaixuan Chen Qiangsheng Huang Jianhao Zhang Jianxin Cheng Xin Fu Chenzhao Zhang Keqi Ma Yaocheng Shi Dries Van Thourhout Gunther Roelkens Liu Liu Sailing He |
| author_sort | Kaixuan Chen |
| collection | DOAJ |
| description | A six-channel wavelength-division-multiplexed optical transceiver with a compact footprint of 1.5 <inline-formula> <tex-math notation="LaTeX">$\times$</tex-math></inline-formula> 0.65 mm<sup>2</sup> for off-chip and on-chip interconnects is demonstrated on a single silicon-on-insulator chip. An arrayed waveguide grating is used as the (de)multiplexer, and III-V electroabsorption sections fabricated by hybrid integration technology are used as both modulators and detectors, which also enable duplex links. The 30-Gb/s capacity for each of the six wavelength channels for the off-chip transceiver is demonstrated. For the on-chip interconnect, an electrical-to-electrical 3-dB bandwidth of 13 GHz and a data rate of 30 Gb/s per wavelength are achieved. |
| format | Article |
| id | doaj-art-78bde0260a8545ad8d35c4e0084af8d4 |
| institution | DOAJ |
| issn | 1943-0655 |
| language | English |
| publishDate | 2016-01-01 |
| publisher | IEEE |
| record_format | Article |
| series | IEEE Photonics Journal |
| spelling | doaj-art-78bde0260a8545ad8d35c4e0084af8d42025-08-20T03:16:04ZengIEEEIEEE Photonics Journal1943-06552016-01-018111010.1109/JPHOT.2016.25169037378272Wavelength-Multiplexed Duplex Transceiver Based on III-V/Si Hybrid Integration for Off-Chip and On-Chip Optical InterconnectsKaixuan Chen0Qiangsheng Huang1Jianhao Zhang2Jianxin Cheng3Xin Fu4Chenzhao Zhang5Keqi Ma6Yaocheng Shi7Dries Van Thourhout8Gunther Roelkens9Liu Liu10Sailing He11Centre for Opt. & Electromagn. Res., South China Normal Univ., Guangzhou, ChinaState Key Lab. for Modern Opt. Instrum., Zhejiang Univ., Hangzhou, ChinaState Key Lab. for Modern Opt. Instrum., Zhejiang Univ., Hangzhou, ChinaCentre for Opt. & Electromagn. Res., South China Normal Univ., Guangzhou, ChinaState Key Lab. for Modern Opt. Instrum., Zhejiang Univ., Hangzhou, ChinaCentre for Opt. & Electromagn. Res., South China Normal Univ., Guangzhou, ChinaState Key Lab. for Modern Opt. Instrum., Zhejiang Univ., Hangzhou, ChinaState Key Lab. for Modern Opt. Instrum., Zhejiang Univ., Hangzhou, ChinaDept. of Inf. Technol., Ghent Univ., Ghent, BelgiumDept. of Inf. Technol., Ghent Univ., Ghent, BelgiumCentre for Opt. & Electromagn. Res., South China Normal Univ., Guangzhou, ChinaCentre for Opt. & Electromagn. Res., South China Normal Univ., Guangzhou, ChinaA six-channel wavelength-division-multiplexed optical transceiver with a compact footprint of 1.5 <inline-formula> <tex-math notation="LaTeX">$\times$</tex-math></inline-formula> 0.65 mm<sup>2</sup> for off-chip and on-chip interconnects is demonstrated on a single silicon-on-insulator chip. An arrayed waveguide grating is used as the (de)multiplexer, and III-V electroabsorption sections fabricated by hybrid integration technology are used as both modulators and detectors, which also enable duplex links. The 30-Gb/s capacity for each of the six wavelength channels for the off-chip transceiver is demonstrated. For the on-chip interconnect, an electrical-to-electrical 3-dB bandwidth of 13 GHz and a data rate of 30 Gb/s per wavelength are achieved.https://ieeexplore.ieee.org/document/7378272/Optical interconnectsWaveguide devicesElectro‐optical systems |
| spellingShingle | Kaixuan Chen Qiangsheng Huang Jianhao Zhang Jianxin Cheng Xin Fu Chenzhao Zhang Keqi Ma Yaocheng Shi Dries Van Thourhout Gunther Roelkens Liu Liu Sailing He Wavelength-Multiplexed Duplex Transceiver Based on III-V/Si Hybrid Integration for Off-Chip and On-Chip Optical Interconnects IEEE Photonics Journal Optical interconnects Waveguide devices Electro‐optical systems |
| title | Wavelength-Multiplexed Duplex Transceiver Based on III-V/Si Hybrid Integration for Off-Chip and On-Chip Optical Interconnects |
| title_full | Wavelength-Multiplexed Duplex Transceiver Based on III-V/Si Hybrid Integration for Off-Chip and On-Chip Optical Interconnects |
| title_fullStr | Wavelength-Multiplexed Duplex Transceiver Based on III-V/Si Hybrid Integration for Off-Chip and On-Chip Optical Interconnects |
| title_full_unstemmed | Wavelength-Multiplexed Duplex Transceiver Based on III-V/Si Hybrid Integration for Off-Chip and On-Chip Optical Interconnects |
| title_short | Wavelength-Multiplexed Duplex Transceiver Based on III-V/Si Hybrid Integration for Off-Chip and On-Chip Optical Interconnects |
| title_sort | wavelength multiplexed duplex transceiver based on iii v si hybrid integration for off chip and on chip optical interconnects |
| topic | Optical interconnects Waveguide devices Electro‐optical systems |
| url | https://ieeexplore.ieee.org/document/7378272/ |
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