Research on heat transfer optimization design for high heat flux SiC power modules

Aiming at the new generation of high-voltage packaged SiC device modules with smaller chip size and higher power density, this paper applied the research methods of numerical simulation and test, and studied heat transfer optimization design based on an new composite phase change cooling technology....

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Bibliographic Details
Main Author: LING Ren
Format: Article
Language:zho
Published: Editorial Department of Electric Drive for Locomotives 2023-03-01
Series:机车电传动
Subjects:
Online Access:http://edl.csrzic.com/thesisDetails#10.13890/j.issn.1000-128X.2023.02.006
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