Research on heat transfer optimization design for high heat flux SiC power modules
Aiming at the new generation of high-voltage packaged SiC device modules with smaller chip size and higher power density, this paper applied the research methods of numerical simulation and test, and studied heat transfer optimization design based on an new composite phase change cooling technology....
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| Main Author: | LING Ren |
|---|---|
| Format: | Article |
| Language: | zho |
| Published: |
Editorial Department of Electric Drive for Locomotives
2023-03-01
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| Series: | 机车电传动 |
| Subjects: | |
| Online Access: | http://edl.csrzic.com/thesisDetails#10.13890/j.issn.1000-128X.2023.02.006 |
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