Research on heat transfer optimization design for high heat flux SiC power modules
Aiming at the new generation of high-voltage packaged SiC device modules with smaller chip size and higher power density, this paper applied the research methods of numerical simulation and test, and studied heat transfer optimization design based on an new composite phase change cooling technology....
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| Format: | Article |
| Language: | zho |
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Editorial Department of Electric Drive for Locomotives
2023-03-01
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| Series: | 机车电传动 |
| Subjects: | |
| Online Access: | http://edl.csrzic.com/thesisDetails#10.13890/j.issn.1000-128X.2023.02.006 |
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| Summary: | Aiming at the new generation of high-voltage packaged SiC device modules with smaller chip size and higher power density, this paper applied the research methods of numerical simulation and test, and studied heat transfer optimization design based on an new composite phase change cooling technology. The results of the optimized design were compared with the conventional profile fin cooling scheme with the same dimensions. The results of comparison show that the temperature rise of the new composite phase change radiator can be reduced by 23.9-32.5 K (39.7%-61.6%) compared with that of the profile fin radiator at the same wind speed with the power of 3×630 W. Under the conditions of the same air cooling system, the range of temperature rise can be reduced by 52%. Under the condition of the same design temperature rise of the radiator, the application power of a single IGBT can increase by about 860 W, or doubling the original power. It has a broad development prospect for the application of high power and high heat flux heat dissipation. |
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| ISSN: | 1000-128X |