Microstructure evolution and fracture mechanism of Mo/Cu alloyed interface during plastic deformation

Mo/Cu laminated metal matrix composites (LMMCs) have demonstrated remarkable potential in electronic packaging and aerospace applications, attributed to their superior comprehensive performance. Currently, Mo/Cu LMMCs can be fabricated by inducing non-equilibrium conditions and employing electro-ass...

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Bibliographic Details
Main Authors: Bo Zhang, Yumeng Wang, Guoguang Li, Yunqi Lu, Wenlong Zhao, Xiaodi Wang, Yang Yang, Hong Xiao, Jinlong Du
Format: Article
Language:English
Published: Elsevier 2025-09-01
Series:Journal of Materials Research and Technology
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Online Access:http://www.sciencedirect.com/science/article/pii/S2238785425019817
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