Microstructure evolution and fracture mechanism of Mo/Cu alloyed interface during plastic deformation
Mo/Cu laminated metal matrix composites (LMMCs) have demonstrated remarkable potential in electronic packaging and aerospace applications, attributed to their superior comprehensive performance. Currently, Mo/Cu LMMCs can be fabricated by inducing non-equilibrium conditions and employing electro-ass...
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| Main Authors: | Bo Zhang, Yumeng Wang, Guoguang Li, Yunqi Lu, Wenlong Zhao, Xiaodi Wang, Yang Yang, Hong Xiao, Jinlong Du |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-09-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785425019817 |
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