Microstructure evolution and fracture mechanism of Mo/Cu alloyed interface during plastic deformation
Mo/Cu laminated metal matrix composites (LMMCs) have demonstrated remarkable potential in electronic packaging and aerospace applications, attributed to their superior comprehensive performance. Currently, Mo/Cu LMMCs can be fabricated by inducing non-equilibrium conditions and employing electro-ass...
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| Main Authors: | , , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-09-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785425019817 |
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| Summary: | Mo/Cu laminated metal matrix composites (LMMCs) have demonstrated remarkable potential in electronic packaging and aerospace applications, attributed to their superior comprehensive performance. Currently, Mo/Cu LMMCs can be fabricated by inducing non-equilibrium conditions and employing electro-assisted processing techniques. However, the influence of Mo/Cu alloyed interfaces on mechanical properties remains insufficiently understood and requires further investigation. In this study, molecular dynamics (MD) simulations were utilized to model the tensile and shear behaviors of the high-temperature and electric-field alloyed interface of the Mo/Cu system. The simulation results reveal that the electric-field alloyed interface exhibits enhanced strength (tensile strength 10.33 GPa, shear strength 5.51 GPa) but reduced plasticity (fracture strain 0.278 in tension) compared to the high-temperature alloyed interface (tensile strength 9.7 GPa, shear strength 5.18 GPa, fracture strain 0.377 in tension), due to dislocation activity. This approach investigates the microstructure evolution and the fracture mechanisms of the alloyed interfaces at the atomic scale. Microstructure disparities lead to dislocation pile-up, ultimately resulting in brittle fracture along grain boundaries. This research provides critical theoretical insights for the development of high-performance Mo/Cu LMMCs. |
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| ISSN: | 2238-7854 |