APA (7th ed.) Citation

JianWei, H., ChunYue, H., Ying, L., Wei, H., & Long, Z. FINITE ELEMENT STRESS AND STRAIN ANALYSIS OF BGA SOLDER JOINT OF BOARD LEVEL OPTICAL INTERCONNECTION MODULE UNDER TEMPERATURE AND VIBRATION COUPLED CONDITION. Editorial Office of Journal of Mechanical Strength.

Chicago Style (17th ed.) Citation

JianWei, HUA, HUANG ChunYue, LIANG Ying, HUANG Wei, and ZHANG Long. FINITE ELEMENT STRESS AND STRAIN ANALYSIS OF BGA SOLDER JOINT OF BOARD LEVEL OPTICAL INTERCONNECTION MODULE UNDER TEMPERATURE AND VIBRATION COUPLED CONDITION. Editorial Office of Journal of Mechanical Strength.

MLA (9th ed.) Citation

JianWei, HUA, et al. FINITE ELEMENT STRESS AND STRAIN ANALYSIS OF BGA SOLDER JOINT OF BOARD LEVEL OPTICAL INTERCONNECTION MODULE UNDER TEMPERATURE AND VIBRATION COUPLED CONDITION. Editorial Office of Journal of Mechanical Strength.