Simulation of electroplating process and influence mechanism for repairing inner and outer surfaces of a gold cup based on COMSOL multiphysics
Conventional restoration of metallic cultural relics often faces challenges due to procedural complexity and high costs. This study presents a COMSOL Multiphysics–based simulation approach to optimize the electroplating restoration of gold artifacts, establishing a digital conservation framework. A...
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| Format: | Article |
| Language: | English |
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Elsevier
2025-09-01
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| Series: | Results in Engineering |
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| Online Access: | http://www.sciencedirect.com/science/article/pii/S2590123025027586 |
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| author | Lifeng Ding Chukun Qiao Linhua Zhang Qiang Li Peiyu Gao Jinhao Niu Jiahao Zhang Hongmei Dong |
| author_facet | Lifeng Ding Chukun Qiao Linhua Zhang Qiang Li Peiyu Gao Jinhao Niu Jiahao Zhang Hongmei Dong |
| author_sort | Lifeng Ding |
| collection | DOAJ |
| description | Conventional restoration of metallic cultural relics often faces challenges due to procedural complexity and high costs. This study presents a COMSOL Multiphysics–based simulation approach to optimize the electroplating restoration of gold artifacts, establishing a digital conservation framework. A three-dimensional model simulated copper (Cu)–tin (Sn) alloy electrodeposition on a gold cup, incorporating a tertiary current distribution to couple the dynamics of the electric and chemical fields. Key findings reveal that edge effects cause the rim and handle tip to exhibit substantially higher current density than that by planar regions, thereby leading to nonuniform coating thickness. A homogeneous coating with 81.25 % Cu–Sn molar ratio is achieved through parameter optimization. Transient analysis demonstrates the critical influence of concentration polarization on the ion transport, providing both the theoretical understanding of and practical restoration strategies for metal artifacts. |
| format | Article |
| id | doaj-art-6fb1ce24d87643aeafc4d3fc4252be3a |
| institution | Kabale University |
| issn | 2590-1230 |
| language | English |
| publishDate | 2025-09-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Results in Engineering |
| spelling | doaj-art-6fb1ce24d87643aeafc4d3fc4252be3a2025-08-20T03:36:49ZengElsevierResults in Engineering2590-12302025-09-012710669110.1016/j.rineng.2025.106691Simulation of electroplating process and influence mechanism for repairing inner and outer surfaces of a gold cup based on COMSOL multiphysicsLifeng Ding0Chukun Qiao1Linhua Zhang2Qiang Li3Peiyu Gao4Jinhao Niu5Jiahao Zhang6Hongmei Dong7Department of Chemistry and Chemical Engineering, Taiyuan Institute of Technology, Taiyuan 030008, PR China; School of Chemistry and Chemical Engineering, North University of China, Taiyuan 030051, China; Corresponding authors.Department of Chemistry and Chemical Engineering, Taiyuan Institute of Technology, Taiyuan 030008, PR China; School of Chemistry and Chemical Engineering, North University of China, Taiyuan 030051, ChinaDepartment of Computer Engineering, Taiyuan Institute of Technology, Taiyuan 030008, ChinaShanxi Key Laboratory of Micro Nano Sensors & Artificial Intelligence Perception, College of Integrated Circuits, Taiyuan University of Technology, Taiyuan, 030024, China; Corresponding authors.Department of Chemistry and Chemical Engineering, Taiyuan Institute of Technology, Taiyuan 030008, PR ChinaDepartment of Chemistry and Chemical Engineering, Taiyuan Institute of Technology, Taiyuan 030008, PR ChinaDepartment of Chemistry and Chemical Engineering, Taiyuan Institute of Technology, Taiyuan 030008, PR ChinaDepartment of Chemistry and Chemical Engineering, Taiyuan Institute of Technology, Taiyuan 030008, PR ChinaConventional restoration of metallic cultural relics often faces challenges due to procedural complexity and high costs. This study presents a COMSOL Multiphysics–based simulation approach to optimize the electroplating restoration of gold artifacts, establishing a digital conservation framework. A three-dimensional model simulated copper (Cu)–tin (Sn) alloy electrodeposition on a gold cup, incorporating a tertiary current distribution to couple the dynamics of the electric and chemical fields. Key findings reveal that edge effects cause the rim and handle tip to exhibit substantially higher current density than that by planar regions, thereby leading to nonuniform coating thickness. A homogeneous coating with 81.25 % Cu–Sn molar ratio is achieved through parameter optimization. Transient analysis demonstrates the critical influence of concentration polarization on the ion transport, providing both the theoretical understanding of and practical restoration strategies for metal artifacts.http://www.sciencedirect.com/science/article/pii/S2590123025027586ElectrochemistryCOMSOL Multiphysics simulationElectroplating restorationHeritage conservationTransient analysis |
| spellingShingle | Lifeng Ding Chukun Qiao Linhua Zhang Qiang Li Peiyu Gao Jinhao Niu Jiahao Zhang Hongmei Dong Simulation of electroplating process and influence mechanism for repairing inner and outer surfaces of a gold cup based on COMSOL multiphysics Results in Engineering Electrochemistry COMSOL Multiphysics simulation Electroplating restoration Heritage conservation Transient analysis |
| title | Simulation of electroplating process and influence mechanism for repairing inner and outer surfaces of a gold cup based on COMSOL multiphysics |
| title_full | Simulation of electroplating process and influence mechanism for repairing inner and outer surfaces of a gold cup based on COMSOL multiphysics |
| title_fullStr | Simulation of electroplating process and influence mechanism for repairing inner and outer surfaces of a gold cup based on COMSOL multiphysics |
| title_full_unstemmed | Simulation of electroplating process and influence mechanism for repairing inner and outer surfaces of a gold cup based on COMSOL multiphysics |
| title_short | Simulation of electroplating process and influence mechanism for repairing inner and outer surfaces of a gold cup based on COMSOL multiphysics |
| title_sort | simulation of electroplating process and influence mechanism for repairing inner and outer surfaces of a gold cup based on comsol multiphysics |
| topic | Electrochemistry COMSOL Multiphysics simulation Electroplating restoration Heritage conservation Transient analysis |
| url | http://www.sciencedirect.com/science/article/pii/S2590123025027586 |
| work_keys_str_mv | AT lifengding simulationofelectroplatingprocessandinfluencemechanismforrepairinginnerandoutersurfacesofagoldcupbasedoncomsolmultiphysics AT chukunqiao simulationofelectroplatingprocessandinfluencemechanismforrepairinginnerandoutersurfacesofagoldcupbasedoncomsolmultiphysics AT linhuazhang simulationofelectroplatingprocessandinfluencemechanismforrepairinginnerandoutersurfacesofagoldcupbasedoncomsolmultiphysics AT qiangli simulationofelectroplatingprocessandinfluencemechanismforrepairinginnerandoutersurfacesofagoldcupbasedoncomsolmultiphysics AT peiyugao simulationofelectroplatingprocessandinfluencemechanismforrepairinginnerandoutersurfacesofagoldcupbasedoncomsolmultiphysics AT jinhaoniu simulationofelectroplatingprocessandinfluencemechanismforrepairinginnerandoutersurfacesofagoldcupbasedoncomsolmultiphysics AT jiahaozhang simulationofelectroplatingprocessandinfluencemechanismforrepairinginnerandoutersurfacesofagoldcupbasedoncomsolmultiphysics AT hongmeidong simulationofelectroplatingprocessandinfluencemechanismforrepairinginnerandoutersurfacesofagoldcupbasedoncomsolmultiphysics |