APA (7th ed.) Citation

Ding, L., Qiao, C., Zhang, L., Li, Q., Gao, P., Niu, J., . . . Dong, H. Simulation of electroplating process and influence mechanism for repairing inner and outer surfaces of a gold cup based on COMSOL multiphysics. Elsevier.

Chicago Style (17th ed.) Citation

Ding, Lifeng, Chukun Qiao, Linhua Zhang, Qiang Li, Peiyu Gao, Jinhao Niu, Jiahao Zhang, and Hongmei Dong. Simulation of Electroplating Process and Influence Mechanism for Repairing Inner and Outer Surfaces of a Gold Cup Based on COMSOL Multiphysics. Elsevier.

MLA (9th ed.) Citation

Ding, Lifeng, et al. Simulation of Electroplating Process and Influence Mechanism for Repairing Inner and Outer Surfaces of a Gold Cup Based on COMSOL Multiphysics. Elsevier.