Spider Silk‐Inspired Conductive Hydrogels for Enhanced Toughness and Environmental Resilience via Dense Hierarchical Structuring

Spider Silk‐Inspired Conductive Hydrogels for Enhanced Toughness and Environmental Resilience via Dense Hierarchical Structuring

Abstract Conductive hydrogels, known for their biocompatibility and responsiveness to external stimuli, hold promise for biomedical applications like wearable sensors, soft robotics, and implantable electronics. However, their broader use is often constrained by limited toughness and environmental r...

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Bibliographic Details
Main Authors: Seokkyoon Hong, Jiwon Lee, Taewoong Park, Jinheon Jeong, Junsang Lee, Hyeonseo Joo, Juan C. Mesa, Claudia Benito Alston, Yuhyun Ji, Sergio Ruiz Vega, Cristian Barinaga, Jonghun Yi, Youngjun Lee, Jun Kim, Kate J. Won, Luis Solorio, Young L. Kim, Hyowon Lee, Dong Rip Kim, Chi Hwan Lee
Format: Article
Language:English
Published: Wiley 2025-03-01
Series:Advanced Science
Subjects:
bioinspired materials
environmental resilience
hierarchical structures
tough hydrogels
wearable sensors
Online Access:https://doi.org/10.1002/advs.202500397
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