Ultra‐Stable and Highly Luminescent Perovskite for Multi‐Color Ultraviolet Single‐Pixel Imaging

Abstract Ultraviolet (UV) detection and spectral imaging technology play a crucial role in information acquisition. However, this wavelength is beyond the silicon detectors’ response range. Currently, all‐inorganic lead halide perovskite nanocrystals exhibit excellent photoluminescent properties con...

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Bibliographic Details
Main Authors: Bin Xu, Menglu Chen, Kenan Zhang, Jianbang Mu, Jie Cao, Hongyu Lv, Haoyu Zhang, Xingting Zhou, Feng Shi, Qun Hao
Format: Article
Language:English
Published: Wiley 2025-07-01
Series:Advanced Science
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Online Access:https://doi.org/10.1002/advs.202504307
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Summary:Abstract Ultraviolet (UV) detection and spectral imaging technology play a crucial role in information acquisition. However, this wavelength is beyond the silicon detectors’ response range. Currently, all‐inorganic lead halide perovskite nanocrystals exhibit excellent photoluminescent properties converting UV photons to visible photons, which provide a solution for UV detection. Nevertheless, their practical application is restricted by poor stability when exposed to water, UV light, or heat. Therefore, it is essential to develop a viable preparation method for producing high‐performance thin film devices. In this study, a design is proposed involving CsPbX3 composites, doped with Mg2+ and coated with Styrene‐Ethylene‐Butylene‐Styrene (SEBS). Notably, the Mg‐CsPbX3@SEBS demonstrate exceptional environmental stability, linearity in UV resistance, and water stability, exhibiting a mere 18% decrease in luminous intensity after 168 h of immersion, Additionally, these composites demonstrate high‐temperature stability, enduring temperatures up to 500 K. Using compressed sensing technology and composite films, multi‐color imaging is also achieved under various UV light conditions with a resolution of 128 × 128 pixels. This work provides valuable insights into the down‐conversion properties of perovskite materials, broadening their potential applications.
ISSN:2198-3844