Study on Surface Hardness and Microstructure of Pure Copper Chip Strips Prepared by LSEM
Large strain extrusion machining (LSEM) is one of the severe plastic deformation (SPD) methods that can improve the mechanical properties of materials. The purpose of this experiment is to study the surface hardness and microstructure of the pure copper chip strips. It was found that most of the gra...
Saved in:
| Main Authors: | , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Wiley
2019-01-01
|
| Series: | Advances in Materials Science and Engineering |
| Online Access: | http://dx.doi.org/10.1155/2019/5254892 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| _version_ | 1849414328872075264 |
|---|---|
| author | Yunyun Pi Xiaolong Yin Wenjun Deng Wei Xia |
| author_facet | Yunyun Pi Xiaolong Yin Wenjun Deng Wei Xia |
| author_sort | Yunyun Pi |
| collection | DOAJ |
| description | Large strain extrusion machining (LSEM) is one of the severe plastic deformation (SPD) methods that can improve the mechanical properties of materials. The purpose of this experiment is to study the surface hardness and microstructure of the pure copper chip strips. It was found that most of the grains of the chip strips had been refined to the ultrafine grain grade. Finite element analysis (FEA) simulations were conducted to predict the von Mises equivalent strains. Based on the analysis of variance (ANOVA), further study indicated that the surface hardness of the chip strips was decided by several key parameters including the chip thickness compression ratio, rake angle, and uncut chip thickness during LSEM. Through this analysis, a set of parameters which have the greatest impact on the properties of the material can be found. This set of parameters helps us to achieve the strip with the best performance. |
| format | Article |
| id | doaj-art-6d8ba2cfb8634b2fae901f10f2b4abea |
| institution | Kabale University |
| issn | 1687-8434 1687-8442 |
| language | English |
| publishDate | 2019-01-01 |
| publisher | Wiley |
| record_format | Article |
| series | Advances in Materials Science and Engineering |
| spelling | doaj-art-6d8ba2cfb8634b2fae901f10f2b4abea2025-08-20T03:33:52ZengWileyAdvances in Materials Science and Engineering1687-84341687-84422019-01-01201910.1155/2019/52548925254892Study on Surface Hardness and Microstructure of Pure Copper Chip Strips Prepared by LSEMYunyun Pi0Xiaolong Yin1Wenjun Deng2Wei Xia3College of Mechanical and Automobile Engineering, South China University of Technology, Guangzhou 510640, ChinaCollege of Mechanical and Automobile Engineering, South China University of Technology, Guangzhou 510640, ChinaCollege of Mechanical and Automobile Engineering, South China University of Technology, Guangzhou 510640, ChinaCollege of Mechanical and Automobile Engineering, South China University of Technology, Guangzhou 510640, ChinaLarge strain extrusion machining (LSEM) is one of the severe plastic deformation (SPD) methods that can improve the mechanical properties of materials. The purpose of this experiment is to study the surface hardness and microstructure of the pure copper chip strips. It was found that most of the grains of the chip strips had been refined to the ultrafine grain grade. Finite element analysis (FEA) simulations were conducted to predict the von Mises equivalent strains. Based on the analysis of variance (ANOVA), further study indicated that the surface hardness of the chip strips was decided by several key parameters including the chip thickness compression ratio, rake angle, and uncut chip thickness during LSEM. Through this analysis, a set of parameters which have the greatest impact on the properties of the material can be found. This set of parameters helps us to achieve the strip with the best performance.http://dx.doi.org/10.1155/2019/5254892 |
| spellingShingle | Yunyun Pi Xiaolong Yin Wenjun Deng Wei Xia Study on Surface Hardness and Microstructure of Pure Copper Chip Strips Prepared by LSEM Advances in Materials Science and Engineering |
| title | Study on Surface Hardness and Microstructure of Pure Copper Chip Strips Prepared by LSEM |
| title_full | Study on Surface Hardness and Microstructure of Pure Copper Chip Strips Prepared by LSEM |
| title_fullStr | Study on Surface Hardness and Microstructure of Pure Copper Chip Strips Prepared by LSEM |
| title_full_unstemmed | Study on Surface Hardness and Microstructure of Pure Copper Chip Strips Prepared by LSEM |
| title_short | Study on Surface Hardness and Microstructure of Pure Copper Chip Strips Prepared by LSEM |
| title_sort | study on surface hardness and microstructure of pure copper chip strips prepared by lsem |
| url | http://dx.doi.org/10.1155/2019/5254892 |
| work_keys_str_mv | AT yunyunpi studyonsurfacehardnessandmicrostructureofpurecopperchipstripspreparedbylsem AT xiaolongyin studyonsurfacehardnessandmicrostructureofpurecopperchipstripspreparedbylsem AT wenjundeng studyonsurfacehardnessandmicrostructureofpurecopperchipstripspreparedbylsem AT weixia studyonsurfacehardnessandmicrostructureofpurecopperchipstripspreparedbylsem |