Compliant Press-Fit Technology Integrated Into a New Back Panel Packaging Approach
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| Main Author: | |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Wiley
1984-01-01
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| Series: | Active and Passive Electronic Components |
| Online Access: | http://dx.doi.org/10.1155/APEC.11.165 |
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| _version_ | 1832552856962465792 |
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| author | A. Kerkhoff |
| author_facet | A. Kerkhoff |
| author_sort | A. Kerkhoff |
| collection | DOAJ |
| format | Article |
| id | doaj-art-6d89822081824750841556adae987e2e |
| institution | Kabale University |
| issn | 0882-7516 1563-5031 |
| language | English |
| publishDate | 1984-01-01 |
| publisher | Wiley |
| record_format | Article |
| series | Active and Passive Electronic Components |
| spelling | doaj-art-6d89822081824750841556adae987e2e2025-02-03T05:57:39ZengWileyActive and Passive Electronic Components0882-75161563-50311984-01-0111216517210.1155/APEC.11.165Compliant Press-Fit Technology Integrated Into a New Back Panel Packaging ApproachA. Kerkhoffhttp://dx.doi.org/10.1155/APEC.11.165 |
| spellingShingle | A. Kerkhoff Compliant Press-Fit Technology Integrated Into a New Back Panel Packaging Approach Active and Passive Electronic Components |
| title | Compliant Press-Fit Technology Integrated Into a New Back Panel Packaging Approach |
| title_full | Compliant Press-Fit Technology Integrated Into a New Back Panel Packaging Approach |
| title_fullStr | Compliant Press-Fit Technology Integrated Into a New Back Panel Packaging Approach |
| title_full_unstemmed | Compliant Press-Fit Technology Integrated Into a New Back Panel Packaging Approach |
| title_short | Compliant Press-Fit Technology Integrated Into a New Back Panel Packaging Approach |
| title_sort | compliant press fit technology integrated into a new back panel packaging approach |
| url | http://dx.doi.org/10.1155/APEC.11.165 |
| work_keys_str_mv | AT akerkhoff compliantpressfittechnologyintegratedintoanewbackpanelpackagingapproach |