APA (7th ed.) Citation

Mi, J., Li, Y., Yang, Y., Peng, W., & Huang, H. Thermal Cycling Life Prediction of Sn-3.0Ag-0.5Cu Solder Joint Using Type-I Censored Data. Wiley.

Chicago Style (17th ed.) Citation

Mi, Jinhua, Yan-Feng Li, Yuan-Jian Yang, Weiwen Peng, and Hong-Zhong Huang. Thermal Cycling Life Prediction of Sn-3.0Ag-0.5Cu Solder Joint Using Type-I Censored Data. Wiley.

MLA (9th ed.) Citation

Mi, Jinhua, et al. Thermal Cycling Life Prediction of Sn-3.0Ag-0.5Cu Solder Joint Using Type-I Censored Data. Wiley.