Open-ended microwave oven with E-field uniformity
In this paper, a new open-ended microwave oven with E-field uniformity has been proposed for microelectronics packaging curing. The open-ended oven contains three dielectrics and an air-filled section, being physically open at one end but electrically shielded due to the evanescent mode in the air-f...
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| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-02-01
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| Series: | Case Studies in Thermal Engineering |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2214157X2500022X |
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