Inhibiting surface and subsurface damage in ultrasonic vibration-assisted ultraprecision diamond cutting of high-entropy alloy
High-entropy alloys (HEAs) are a potential industrial material for large-scale applications because of their superior physical and chemical attributes. However, owing to the incomplete understanding of the manufacturing mechanism for this material, it is a challenge to realize ultra-precision nanosc...
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Elsevier
2025-01-01
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| Series: | Journal of Materials Research and Technology |
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| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785424029272 |
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| author | Yintian Xing Yue Liu Yuhan Li Tengfei Yin Denghui Li Changxi Xue Wai Sze Yip Suet To |
| author_facet | Yintian Xing Yue Liu Yuhan Li Tengfei Yin Denghui Li Changxi Xue Wai Sze Yip Suet To |
| author_sort | Yintian Xing |
| collection | DOAJ |
| description | High-entropy alloys (HEAs) are a potential industrial material for large-scale applications because of their superior physical and chemical attributes. However, owing to the incomplete understanding of the manufacturing mechanism for this material, it is a challenge to realize ultra-precision nanoscale manufacturing of HEAs while preventing surface and subsurface damage. Therefore, in this work, ultrasonic vibration-assisted diamond cutting (UVDC) was utilized to manufacture HEAs workpieces, with the aim of clarifying and revealing the formation mechanisms of high-precision surface integrity. The scientific phenomena of material removal characteristics are explored and investigated, encompassing a range from macroscopic surface overall topography to microscopic subsurface atomic changes. This is achieved through comprehensive comparisons of the workpiece surface, subsurface features, chip morphology, and tool damage in cutting processes with and without high-frequency ultrasonic vibration assistance. Results indicate that the diverse machinability advantages of HEAs in intermittent cutting can effectively inhibit surface and subsurface damage, including better cutting stability, smoother material removal, and lower tool wear. This study enhances the understanding of the high-precision surface formation mechanisms in HEAs by suppressing damage during UVDC, thereby meeting the stringent demands of practical applications. |
| format | Article |
| id | doaj-art-6b481178f63347fcacaba411fa980c45 |
| institution | Kabale University |
| issn | 2238-7854 |
| language | English |
| publishDate | 2025-01-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Journal of Materials Research and Technology |
| spelling | doaj-art-6b481178f63347fcacaba411fa980c452025-01-19T06:25:33ZengElsevierJournal of Materials Research and Technology2238-78542025-01-0134880897Inhibiting surface and subsurface damage in ultrasonic vibration-assisted ultraprecision diamond cutting of high-entropy alloyYintian Xing0Yue Liu1Yuhan Li2Tengfei Yin3Denghui Li4Changxi Xue5Wai Sze Yip6Suet To7State Key Laboratory of Ultra-precision Machining Technology, Department of Industrial and Systems Engineering, The Hong Kong Polytechnic University, Hong Kong, ChinaDepartment of Optical Engineering, Changchun University of Science and Technology, Changchun, ChinaState Key Laboratory of Ultra-precision Machining Technology, Department of Industrial and Systems Engineering, The Hong Kong Polytechnic University, Hong Kong, ChinaState Key Laboratory of Ultra-precision Machining Technology, Department of Industrial and Systems Engineering, The Hong Kong Polytechnic University, Hong Kong, ChinaState Key Laboratory of Ultra-precision Machining Technology, Department of Industrial and Systems Engineering, The Hong Kong Polytechnic University, Hong Kong, ChinaDepartment of Optical Engineering, Changchun University of Science and Technology, Changchun, ChinaState Key Laboratory of Ultra-precision Machining Technology, Department of Industrial and Systems Engineering, The Hong Kong Polytechnic University, Hong Kong, China; Corresponding author.State Key Laboratory of Ultra-precision Machining Technology, Department of Industrial and Systems Engineering, The Hong Kong Polytechnic University, Hong Kong, China; The Hong Kong Polytechnic University Shenzhen Research Institute, China; Corresponding author. State Key Laboratory of Ultra-precision Machining Technology, Department of Industrial and Systems Engineering, The Hong Kong Polytechnic University, Hong Kong, China.High-entropy alloys (HEAs) are a potential industrial material for large-scale applications because of their superior physical and chemical attributes. However, owing to the incomplete understanding of the manufacturing mechanism for this material, it is a challenge to realize ultra-precision nanoscale manufacturing of HEAs while preventing surface and subsurface damage. Therefore, in this work, ultrasonic vibration-assisted diamond cutting (UVDC) was utilized to manufacture HEAs workpieces, with the aim of clarifying and revealing the formation mechanisms of high-precision surface integrity. The scientific phenomena of material removal characteristics are explored and investigated, encompassing a range from macroscopic surface overall topography to microscopic subsurface atomic changes. This is achieved through comprehensive comparisons of the workpiece surface, subsurface features, chip morphology, and tool damage in cutting processes with and without high-frequency ultrasonic vibration assistance. Results indicate that the diverse machinability advantages of HEAs in intermittent cutting can effectively inhibit surface and subsurface damage, including better cutting stability, smoother material removal, and lower tool wear. This study enhances the understanding of the high-precision surface formation mechanisms in HEAs by suppressing damage during UVDC, thereby meeting the stringent demands of practical applications.http://www.sciencedirect.com/science/article/pii/S2238785424029272Ultrasonic vibration-assisted diamond cuttingSurface damage featuresSubsurface microstructure characteristicsHigh-entropy alloys |
| spellingShingle | Yintian Xing Yue Liu Yuhan Li Tengfei Yin Denghui Li Changxi Xue Wai Sze Yip Suet To Inhibiting surface and subsurface damage in ultrasonic vibration-assisted ultraprecision diamond cutting of high-entropy alloy Journal of Materials Research and Technology Ultrasonic vibration-assisted diamond cutting Surface damage features Subsurface microstructure characteristics High-entropy alloys |
| title | Inhibiting surface and subsurface damage in ultrasonic vibration-assisted ultraprecision diamond cutting of high-entropy alloy |
| title_full | Inhibiting surface and subsurface damage in ultrasonic vibration-assisted ultraprecision diamond cutting of high-entropy alloy |
| title_fullStr | Inhibiting surface and subsurface damage in ultrasonic vibration-assisted ultraprecision diamond cutting of high-entropy alloy |
| title_full_unstemmed | Inhibiting surface and subsurface damage in ultrasonic vibration-assisted ultraprecision diamond cutting of high-entropy alloy |
| title_short | Inhibiting surface and subsurface damage in ultrasonic vibration-assisted ultraprecision diamond cutting of high-entropy alloy |
| title_sort | inhibiting surface and subsurface damage in ultrasonic vibration assisted ultraprecision diamond cutting of high entropy alloy |
| topic | Ultrasonic vibration-assisted diamond cutting Surface damage features Subsurface microstructure characteristics High-entropy alloys |
| url | http://www.sciencedirect.com/science/article/pii/S2238785424029272 |
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