To suppress tin whisker growth by using (100)-oriented copper
Effect of Cu crystallographic orientations on the Sn whisker growth is investigated in this study. Three types of Cu under-layer (randomly, <111>, <100>-oriented) were prepared for electroplating of pure Sn. After 672 h of room temperature (RT) storage, a lot of whiskers were found on th...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-03-01
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| Series: | Journal of Materials Research and Technology |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785425002686 |
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