Microstructure Development of Powder-Based Cu Composite During High Shear Strain Processing
Commercially pure Cu features excellent electric conductivity but low mechanical properties. In order to improve the mechanical properties of Cu, strengthening elements can be added to prepare alloys or composites featuring enhanced performances. This study focuses on the detailed characterization o...
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| Main Authors: | Lenka Kunčická, Josef Walek, Radim Kocich |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2024-11-01
|
| Series: | Metals |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2075-4701/14/12/1331 |
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