Improved Hybrid Circuit Assembly Yields and Reliability by Glassivation of the Semiconductor Chip

Improved Hybrid Circuit Assembly Yields and Reliability by Glassivation of the Semiconductor Chip

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Bibliographic Details
Main Authors:	S. A. France, B. C. Heap
Format:	Article
Language:	English
Published:	Wiley 1977-01-01
Series:	Active and Passive Electronic Components
Online Access:	http://dx.doi.org/10.1155/APEC.4.117
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