Improved Hybrid Circuit Assembly Yields and Reliability by Glassivation of the Semiconductor Chip
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| Main Authors: | , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Wiley
1977-01-01
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| Series: | Active and Passive Electronic Components |
| Online Access: | http://dx.doi.org/10.1155/APEC.4.117 |
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| _version_ | 1849413658074939392 |
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| author | S. A. France B. C. Heap |
| author_facet | S. A. France B. C. Heap |
| author_sort | S. A. France |
| collection | DOAJ |
| format | Article |
| id | doaj-art-683f45eb214445d49ed31d89f376aeb3 |
| institution | Kabale University |
| issn | 0882-7516 1563-5031 |
| language | English |
| publishDate | 1977-01-01 |
| publisher | Wiley |
| record_format | Article |
| series | Active and Passive Electronic Components |
| spelling | doaj-art-683f45eb214445d49ed31d89f376aeb32025-08-20T03:34:04ZengWileyActive and Passive Electronic Components0882-75161563-50311977-01-0143-411712410.1155/APEC.4.117Improved Hybrid Circuit Assembly Yields and Reliability by Glassivation of the Semiconductor ChipS. A. FranceB. C. Heaphttp://dx.doi.org/10.1155/APEC.4.117 |
| spellingShingle | S. A. France B. C. Heap Improved Hybrid Circuit Assembly Yields and Reliability by Glassivation of the Semiconductor Chip Active and Passive Electronic Components |
| title | Improved Hybrid Circuit Assembly Yields and Reliability by Glassivation of the Semiconductor Chip |
| title_full | Improved Hybrid Circuit Assembly Yields and Reliability by Glassivation of the Semiconductor Chip |
| title_fullStr | Improved Hybrid Circuit Assembly Yields and Reliability by Glassivation of the Semiconductor Chip |
| title_full_unstemmed | Improved Hybrid Circuit Assembly Yields and Reliability by Glassivation of the Semiconductor Chip |
| title_short | Improved Hybrid Circuit Assembly Yields and Reliability by Glassivation of the Semiconductor Chip |
| title_sort | improved hybrid circuit assembly yields and reliability by glassivation of the semiconductor chip |
| url | http://dx.doi.org/10.1155/APEC.4.117 |
| work_keys_str_mv | AT safrance improvedhybridcircuitassemblyyieldsandreliabilitybyglassivationofthesemiconductorchip AT bcheap improvedhybridcircuitassemblyyieldsandreliabilitybyglassivationofthesemiconductorchip |